LFE2M70E-6FN900C
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- Mfr.Part #
- LFE2M70E-6FN900C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 416 I/O 900FBGA
- Stock
- 117
- In Stock ：
- 117
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Series :
- ECP2M
- Length :
- 31mm
- REACH SVHC :
- No SVHC
- Time@Peak Reflow Temperature-Max (s) :
- 30
- HTS Code :
- 8542.39.00.01
- Number of Logic Elements/Cells :
- 67000
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- JESD-609 Code :
- e1
- Number of Pins :
- 900
- Reach Compliance Code :
- not_compliant
- Combinatorial Delay of a CLB-Max :
- 0.331 ns
- Number of Logic Cells :
- 70000
- RoHS Status :
- ROHS3 Compliant
- Mount :
- Surface Mount
- Width :
- 31mm
- Lead Free :
- Lead Free
- Height Seated (Max) :
- 2.6mm
- Terminal Pitch :
- 1mm
- Frequency :
- 357MHz
- Terminal Form :
- Ball
- ECCN Code :
- EAR99
- Voltage - Supply :
- 1.14V~1.26V
- Factory Lead Time :
- 8 Weeks
- Terminal Position :
- BOTTOM
- Packaging :
- Tray
- Base Part Number :
- LFE2M70
- Supply Voltage :
- 1.2V
- Memory Size :
- 584.9kB
- Peak Reflow Temperature (Cel) :
- 250
- Mounting Type :
- Surface Mount
- Number of Outputs :
- 416
- Number of Terminations :
- 900
- Pbfree Code :
- yes
- Operating Supply Voltage :
- 1.2V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of I/O :
- 416
- Number of LABs/CLBs :
- 8375
- RAM Size :
- 566.8kB
- Pin Count :
- 900
- Qualification Status :
- Not Qualified
- Total RAM Bits :
- 4642816
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Published :
- 2008
- Number of Macro Cells :
- 34000
- Package / Case :
- 900-BBGA
- Operating Temperature :
- 0°C~85°C TJ
- Datasheets
- LFE2M70E-6FN900C
FPGAs Lattice Semiconductor LFE2M70E-6FN900C Overview
The Lattice Semiconductor LFE2M70E-6FN900C FPGA is a high-performance field-programmable gate array designed for advanced electronic applications. This IC FPGA integrates a robust 416 I/O pin configuration within a compact 900FBGA package, providing a versatile platform for developing complex digital and mixed-signal systems. The FPGAs Lattice Semiconductor LFE2M70E-6FN900C is engineered to meet the demanding needs of modern technology sectors, offering scalability and high-speed performance essential for handling intricate algorithm processing and data-intensive tasks. Its ability to be reprogrammed on the fly enables significant flexibility in hardware updates without needing physical replacement, making it a preferred choice for businesses looking to future-proof their technological investments.
LFE2M70E-6FN900C Features
The LFE2M70E-6FN900C boasts a range of features suited for high-demand applications. Key features include a large number of input/output pins which facilitate extensive connectivity and high configurability. The device's 900-ball fine-pitch ball grid array (FBGA) packaging allows for a more condensed board space usage while enhancing the overall thermal and electrical performance. Additionally, the FPGA is designed with power efficiency in mind, supporting complex digital functionalities at a reduced power cost.
LFE2M70E-6FN900C Applications
- Telecommunications Equipment: Used in routers and switches, the LFE2M70E-6FN900C helps manage data traffic efficiently and enhance bandwidth capacity.
- Industrial Automation: Integrates into control systems to process real-time data and automate complex industrial processes.
- Automotive Technology: Supports advanced driver-assistance systems (ADAS) by processing multiple data inputs from vehicle sensors quickly and reliably.
- Consumer Electronics: Used in high-definition multimedia interfaces (HDMI) and portable devices, ensuring smooth and rapid data processing and display management.
- Medical Devices: Facilitates the development of medical imaging systems, such as MRI and ultrasound machines, by handling significant data throughput and real-time image processing.
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