LFE2M70E-6F900C
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- Mfr.Part #
- LFE2M70E-6F900C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 416 I/O 900FBGA
- Stock
- 19,927
- In Stock ：
- 19,927
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Qualification Status :
- Not Qualified
- Number of I/O :
- 416
- Mounting Type :
- Surface Mount
- ECCN Code :
- EAR99
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 8375
- Height Seated (Max) :
- 2.6mm
- Base Part Number :
- LFE2M70
- HTS Code :
- 8542.39.00.01
- Voltage - Supply :
- 1.14V~1.26V
- Terminal Form :
- Ball
- Pin Count :
- 900
- Width :
- 31mm
- Peak Reflow Temperature (Cel) :
- 225
- Number of Pins :
- 900
- Reach Compliance Code :
- not_compliant
- Terminal Position :
- BOTTOM
- Packaging :
- Tray
- Package / Case :
- 900-BBGA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Total RAM Bits :
- 4642816
- Number of Terminations :
- 900
- Published :
- 2012
- Number of Logic Elements/Cells :
- 67000
- Length :
- 31mm
- JESD-609 Code :
- e0
- Pbfree Code :
- No
- Supply Voltage :
- 1.2V
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Logic Cells :
- 70000
- Operating Temperature :
- 0°C~85°C TJ
- Series :
- ECP2M
- Number of Outputs :
- 416
- RoHS Status :
- Non-RoHS Compliant
- Memory Size :
- 584.9kB
- Lead Free :
- Lead Free
- Combinatorial Delay of a CLB-Max :
- 0.331 ns
- Mount :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Pitch :
- 1mm
- Operating Supply Voltage :
- 1.2V
- RAM Size :
- 566.8kB
- Max Frequency :
- 357MHz
- Datasheets
- LFE2M70E-6F900C
FPGAs Lattice Semiconductor LFE2M70E-6F900C Overview
Introducing the FPGAs Lattice Semiconductor LFE2M70E-6F900C, a high-performance Field Programmable Gate Array (FPGA) that delivers exceptional functionality and flexibility for a wide range of applications. Designed by Lattice Semiconductor, a leader in smart connectivity solutions, this FPGA features a robust 900FBGA package, accommodating a dense configuration of 416 I/Os. Ideal for designers looking to develop complex, next-generation digital systems, the LFE2M70E-6F900C stands out in the industry for its ability to support advanced digital processing tasks and its scalable integration features, enhancing both product performance and reliability.
LFE2M70E-6F900C Features
The LFE2M70E-6F900C FPGA is equipped with numerous features that make it a top choice for developers and engineers. It includes a dense array of 416 input/output ports, which provides expansive connectivity options and flexibility in system design. The FPGA is packaged in a 900FBGA format, which assures a compact footprint while allowing for robust performance in demanding environments. Its configuration and programmability make it an ideal solution for customizing applications that require specific, tailored functionalities.
LFE2M70E-6F900C Applications
- Telecommunications Equipment: Utilizes its high I/O capacity for managing multiple signal inputs and outputs in routers and switches, enhancing network efficiency and data handling capabilities.
- Industrial Automation: Can be programmed to control machinery operations, process monitoring, and safety checks, optimizing productivity and reliability in manufacturing processes.
- Consumer Electronics: Serves in the development of advanced consumer electronics, such as gaming consoles and high-definition televisions, by supporting sophisticated user interfaces and high-speed data processing.
- Automotive Applications: Improves automotive safety and entertainment systems by facilitating faster processing and response times, crucial for real-time applications.
- Medical Devices: Ensures precision and adaptability in medical imaging systems, aiding in complex diagnostic procedures through rapid data processing and image manipulation.
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