LFE2M50E-6F672C
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- Mfr.Part #
- LFE2M50E-6F672C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 672-BBGA
- Datasheet
- Download
- Description
- IC FPGA 372 I/O 672FPBGA
- Stock
- 26,615
- In Stock ：
- 26,615
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Series :
- ECP2M
- Mount :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Voltage - Supply :
- 1.14V~1.26V
- Operating Supply Voltage :
- 1.2V
- Length :
- 27mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Height Seated (Max) :
- 2.6mm
- JESD-609 Code :
- e0
- Base Part Number :
- LFE2M50
- Packaging :
- Tray
- Published :
- 2012
- Package / Case :
- 672-BBGA
- Pbfree Code :
- No
- Terminal Pitch :
- 1mm
- Lead Free :
- Lead Free
- Terminal Form :
- Ball
- Max Frequency :
- 357MHz
- Number of Logic Elements/Cells :
- 48000
- Total RAM Bits :
- 4246528
- Number of Terminations :
- 672
- Memory Size :
- 531kB
- Width :
- 27mm
- Number of Logic Cells :
- 50000
- Mounting Type :
- Surface Mount
- ECCN Code :
- EAR99
- Number of I/O :
- 372
- HTS Code :
- 8542.39.00.01
- Pin Count :
- 672
- Terminal Position :
- BOTTOM
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Operating Temperature :
- 0°C~85°C TJ
- Supply Voltage :
- 1.2V
- Number of LABs/CLBs :
- 6000
- Peak Reflow Temperature (Cel) :
- 225
- Reach Compliance Code :
- not_compliant
- Combinatorial Delay of a CLB-Max :
- 0.331 ns
- RAM Size :
- 518.4kB
- RoHS Status :
- Non-RoHS Compliant
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Pins :
- 672
- Qualification Status :
- Not Qualified
- Number of Outputs :
- 372
- Datasheets
- LFE2M50E-6F672C
LFE2M50E-6F672C Documents
FPGAs Lattice Semiconductor LFE2M50E-6F672C Overview
The FPGAs Lattice Semiconductor LFE2M50E-6F672C is a highly versatile, field-programmable gate array component that excels in complex digital systems. Designed and manufactured by Lattice Semiconductor, this IC features a robust 672-pin FBGA package that facilitates efficient thermal management and compact board design. Its flexible I/O options, coupled with substantial logic density, make it ideal for a wide range of applications, from consumer electronics to industrial automation systems. This product is particularly well-suited for designers looking for a balance between performance and power consumption, providing a reliable foundation for developing high-performance, feature-rich applications.
LFE2M50E-6F672C Features
This FPGA boasts 372 I/O pins, offering extensive connectivity options and flexibility in system design. The high I/O count is crucial for applications requiring numerous parallel inputs and outputs, such as signal processing and real-time data aggregation. The compact 672-pin fine-pitch ball grid array (FBGA) package ensures minimized space usage on PCBs, making it an excellent choice for space-constrained applications. Moreover, the LFE2M50E-6F672C supports various logic configurations, allowing for tailored functionalities that meet specific project requirements.
LFE2M50E-6F672C Applications
- Consumer Electronics: Utilized in devices such as smartphones and tablets to manage signal processing tasks efficiently, enhancing user interface responsiveness and multitasking capabilities.
- Industrial Automation: Employs its robust I/O capabilities to interface with sensors and actuators, facilitating complex control systems and improving operational efficiency in manufacturing processes.
- Telecommunications Infrastructure: Supports the high-speed processing needs of telecommunications equipment, contributing to improved data transfer rates and network reliability.
- Automotive Technology: Applied in advanced driver-assistance systems (ADAS) to process multiple inputs simultaneously, ensuring real-time responsiveness under various driving conditions.
- Medical Devices: Key in the operation of diagnostic and monitoring equipment, where precision and reliability are paramount for patient care and medical data accuracy.
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