LFE2M35E-6F672I

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Mfr.Part #
LFE2M35E-6F672I
Manufacturer
Lattice Semiconductor
Package / Case
672-BBGA
Datasheet
Download
Description
IC FPGA 410 I/O 672FPBGA
Stock
27,663
In Stock :
27,663

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Mount :
Surface Mount
Width :
27mm
Number of Terminations :
672
Terminal Pitch :
1mm
Combinatorial Delay of a CLB-Max :
0.331 ns
Number of Pins :
672
Number of I/O :
410
Published :
2008
Lead Free :
Lead Free
Operating Supply Voltage :
1.2V
RAM Size :
262.6kB
Mounting Type :
Surface Mount
Supply Voltage :
1.2V
Number of Logic Elements/Cells :
34000
Height Seated (Max) :
2.6mm
Operating Temperature :
-40°C~100°C TJ
Number of Outputs :
410
Length :
27mm
Pin Count :
672
Memory Size :
271.5kB
Terminal Position :
BOTTOM
Time@Peak Reflow Temperature-Max (s) :
30
ECCN Code :
EAR99
Peak Reflow Temperature (Cel) :
225
Terminal Finish :
Tin/Lead (Sn63Pb37)
Pbfree Code :
No
Number of Logic Cells :
35000
Total RAM Bits :
2151424
Base Part Number :
LFE2M35
RoHS Status :
Non-RoHS Compliant
JESD-609 Code :
e0
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Reach Compliance Code :
not_compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
HTS Code :
8542.39.00.01
Qualification Status :
Not Qualified
Series :
ECP2M
Package / Case :
672-BBGA
Number of LABs/CLBs :
4250
Terminal Form :
Ball
Voltage - Supply :
1.14V~1.26V
Max Frequency :
357MHz
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M35E-6F672I from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:672, Number of Pins:672, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Base Part Number:LFE2M35, Package / Case:672-BBGA, LFE2M35E-6F672I pinout, LFE2M35E-6F672I datasheet PDF, LFE2M35E-6F672I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M35E-6F672I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE2M35E-6F672I


FPGAs Lattice Semiconductor LFE2M35E-6F672I Overview

Introducing the FPGAs Lattice Semiconductor LFE2M35E-6F672I, a high-performance field-programmable gate array designed for optimal versatility in complex electronic environments. This IC from Lattice Semiconductor exemplifies cutting-edge technology with a robust package of 672FPBGA that facilitates efficient thermal management and space-saving design. With its 410 programmable I/O options, it provides ample flexibility for hardware interfacing, making it ideal for a multitude of industrial applications. Engineers and developers seeking reliable solutions for high-speed digital signal processing will find the LFE2M35E-6F672I to be an invaluable component in their electronic design projects.

LFE2M35E-6F672I Features

The LFE2M35E-6F672I FPGA is equipped with numerous features that stand out in the field of programmable logic solutions. This includes a high-density grid of 410 user-programmable I/O pins, support for advanced digital signal processing, and a 672-pin fine-pitch ball grid array (FPBGA) package that ensures a compact footprint with superior connectivity. Its high configurability and adaptability make it an essential tool for developers looking to push the boundaries of technological innovation.

LFE2M35E-6F672I Applications

  • Communications Infrastructure: Utilized in routers, switches, and network bridges to manage data flow efficiently and improve network reliability.
  • Industrial Automation: Deployed in control systems for factories and plants to enhance operational efficiency and process automation.
  • Consumer Electronics: Integral in developing high-performance computing devices such as gaming consoles and smart TVs to handle complex user interfaces and graphics processing.
  • Automotive Systems: Used in advanced driver-assistance systems (ADAS) to process real-time sensory data and improve vehicle safety features.
  • Medical Equipment: Applied in medical diagnostic devices for faster processing capabilities that support complex imaging technologies and patient monitoring systems.
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