LFE2M35E-6F672C

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Mfr.Part #
LFE2M35E-6F672C
Manufacturer
Lattice Semiconductor
Package / Case
672-BBGA
Datasheet
Download
Description
IC FPGA 410 I/O 672FPBGA
Stock
23,273
In Stock :
23,273

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Memory Size :
271.5kB
Operating Supply Voltage :
1.2V
RAM Size :
262.6kB
Number of Terminations :
672
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
HTS Code :
8542.39.00.01
Base Part Number :
LFE2M35
Published :
2008
Combinatorial Delay of a CLB-Max :
0.331 ns
Terminal Finish :
Tin/Lead (Sn63Pb37)
Mounting Type :
Surface Mount
Pbfree Code :
No
Series :
ECP2M
Width :
27mm
Number of LABs/CLBs :
4250
Height Seated (Max) :
2.6mm
Terminal Pitch :
1mm
Number of I/O :
410
Reach Compliance Code :
not_compliant
Number of Logic Cells :
35000
RoHS Status :
Non-RoHS Compliant
Pin Count :
672
Lead Free :
Lead Free
JESD-609 Code :
e0
Package / Case :
672-BBGA
Number of Pins :
672
Number of Outputs :
410
Time@Peak Reflow Temperature-Max (s) :
30
Voltage - Supply :
1.14V~1.26V
Terminal Position :
BOTTOM
Max Frequency :
357MHz
Length :
27mm
Mount :
Surface Mount
Qualification Status :
Not Qualified
Supply Voltage :
1.2V
ECCN Code :
EAR99
Operating Temperature :
0°C~85°C TJ
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells :
34000
Packaging :
Tray
Terminal Form :
Ball
Total RAM Bits :
2151424
Peak Reflow Temperature (Cel) :
225
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M35E-6F672C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:672, Base Part Number:LFE2M35, Mounting Type:Surface Mount, Package / Case:672-BBGA, Number of Pins:672, Operating Temperature:0°C~85°C TJ, LFE2M35E-6F672C pinout, LFE2M35E-6F672C datasheet PDF, LFE2M35E-6F672C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M35E-6F672C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE2M35E-6F672C


FPGAs Lattice Semiconductor LFE2M35E-6F672C Overview

Introducing the FPGAs Lattice Semiconductor LFE2M35E-6F672C, a cutting-edge IC FPGA designed for demanding applications that require high-speed data processing and flexibility. This robust FPGA features a 672-pin Fine Pitch Ball Grid Array (FPBGA) package, ensuring compact size without compromising on functionality. With its capability to handle 410 I/O points, this product is engineered to provide exceptional performance and scalability. Manufactured by Lattice Semiconductor, a leader in the FPGA market, the LFE2M35E-6F672C is ideal for designers looking for a high-quality, reliable solution for their sophisticated electronic systems.

LFE2M35E-6F672C Features

The LFE2M35E-6F672C from Lattice Semiconductor boasts several impressive features that make it suitable for a variety of applications. Key features include a high I/O count of 410, a 672FPBGA package for dense yet manageable circuit design, and advanced power management capabilities. This FPGA supports a wide range of configuration options, offering designers the flexibility to tailor it to their specific needs. Additionally, its high-speed data processing abilities make it an excellent choice for projects that require rapid data throughput.

LFE2M35E-6F672C Applications

  • Telecommunications Infrastructure: Utilized in routers and switches, the LFE2M35E-6F672C helps manage data traffic efficiently, ensuring smooth and reliable network performance.
  • Automotive Applications: Can be integrated into automotive safety and control systems, providing the necessary processing power for advanced driver-assistance systems (ADAS).
  • Consumer Electronics: Essential in smart home devices, where it enables sophisticated control and connectivity features.
  • Industrial Automation: Helps in managing complex processes in automation and control systems, enhancing operational efficiency and reliability.
  • Medical Equipment: Applied in medical imaging systems, where its high processing capabilities support detailed and rapid image processing.
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