LFE2M35E-6F256I
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- Mfr.Part #
- LFE2M35E-6F256I
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 140 I/O 256FBGA
- Stock
- 36,889
- In Stock ：
- 36,889
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Height Seated (Max) :
- 2.1mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits :
- 2151424
- Max Frequency :
- 357MHz
- Series :
- ECP2M
- Number of I/O :
- 140
- Reach Compliance Code :
- not_compliant
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Logic Elements/Cells :
- 34000
- Number of Terminations :
- 256
- Number of Outputs :
- 140
- Operating Supply Voltage :
- 1.2V
- Memory Size :
- 271.5kB
- ECCN Code :
- EAR99
- RAM Size :
- 262.6kB
- Pin Count :
- 256
- Operating Temperature :
- -40°C~100°C TJ
- JESD-609 Code :
- e0
- Package / Case :
- 256-BGA
- Lead Free :
- Lead Free
- Terminal Form :
- Ball
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of LABs/CLBs :
- 4250
- Supply Voltage :
- 1.2V
- Length :
- 17mm
- Voltage - Supply :
- 1.14V~1.26V
- Pbfree Code :
- No
- Width :
- 17mm
- Combinatorial Delay of a CLB-Max :
- 0.331 ns
- Terminal Pitch :
- 1mm
- Published :
- 2008
- Number of Logic Cells :
- 35000
- Time@Peak Reflow Temperature-Max (s) :
- 30
- HTS Code :
- 8542.39.00.01
- Mounting Type :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- 225
- RoHS Status :
- Non-RoHS Compliant
- Packaging :
- Tray
- Qualification Status :
- Not Qualified
- Number of Pins :
- 256
- Terminal Position :
- BOTTOM
- Mount :
- Surface Mount
- Base Part Number :
- LFE2M35
- Datasheets
- LFE2M35E-6F256I
LFE2M35E-6F256I Documents
FPGAs Lattice Semiconductor LFE2M35E-6F256I Overview
The LFE2M35E-6F256I from Lattice Semiconductor represents a leading-edge solution in the field of Field Programmable Gate Arrays (FPGAs). This highly versatile chip is engineered to support a wide range of applications, offering robust functionality and adaptability in a compact 256FBGA package. As a part of Lattice Semiconductor's renowned FPGA product line, the LFE2M35E-6F256I provides a perfect blend of power, performance, and footprint, making it an ideal choice for developers looking to push the boundaries of innovation in hardware design. This chip excels in environments where space and power efficiency are critical, without compromising on processing power. The use of the FPGAs Lattice Semiconductor LFE2M35E-6F256I in your designs ensures optimal performance and scalability, paving the way for substantial advancements in electronic device capabilities.
LFE2M35E-6F256I Features
This FPGA chip boasts an impressive array of features including a rich set of 140 I/O pins, allowing for extensive connectivity and interface options. Its 256FBGA packaging is designed for durable and reliable deployment in varied environments. Additionally, the LFE2M35E-6F256I is equipped with advanced security protocols, ensuring the integrity and safety of applications. High configurability and a fast reprogramming capability make it suitable for rapid prototyping and iterative testing, which are crucial in R&D and commercial production settings.
LFE2M35E-6F256I Applications
- Consumer Electronics: Utilized in devices such as smart TVs and gaming consoles, where its ability to handle multiple inputs and outputs enhances user interfaces and connectivity.
- Automotive Applications: Serves crucial functions in vehicle infotainment systems and advanced driver-assistance systems (ADAS), where reliability and fast processing are paramount.
- Industrial Automation: In automation systems, this FPGA aids in managing complex processes by facilitating reliable real-time control and decision-making capabilities.
- Telecommunications: Critical for network infrastructure equipment, supporting high-speed data transmission and encryption with exceptional efficiency and security.
- Medical Devices: Applied in medical imaging systems and diagnostic equipment, improving processing capabilities and image resolution while maintaining compact device sizes.
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