LFE2M20SE-5FN256C

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Mfr.Part #
LFE2M20SE-5FN256C
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 140 I/O 256FBGA
Stock
30,805
In Stock :
30,805

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Published :
2008
Mounting Type :
Surface Mount
HTS Code :
8542.39.00.01
Series :
ECP2M
Number of I/O :
140
Lead Free :
Lead Free
Radiation Hardening :
No
Pbfree Code :
yes
Length :
17mm
Supply Voltage :
1.2V
Number of Pins :
256
Voltage - Supply :
1.14V~1.26V
Operating Supply Voltage :
1.2V
RoHS Status :
ROHS3 Compliant
Number of Outputs :
140
Terminal Pitch :
1mm
Factory Lead Time :
8 Weeks
Terminal Position :
BOTTOM
Number of Logic Cells :
20000
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
ECCN Code :
EAR99
Peak Reflow Temperature (Cel) :
250
Pin Count :
256
Mount :
Surface Mount
Number of LABs/CLBs :
2375
Packaging :
Tray
Combinatorial Delay of a CLB-Max :
0.358 ns
Total RAM Bits :
1246208
Memory Size :
157.3kB
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RAM Size :
152.1kB
JESD-609 Code :
e1
Width :
17mm
Time@Peak Reflow Temperature-Max (s) :
30
Base Part Number :
LFE2M20
Number of Logic Elements/Cells :
19000
Height Seated (Max) :
2.1mm
Max Frequency :
311MHz
Number of Terminations :
256
Package / Case :
256-BGA
Operating Temperature :
0°C~85°C TJ
Datasheets
LFE2M20SE-5FN256C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M20SE-5FN256C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Pins:256, Base Part Number:LFE2M20, Number of Terminations:256, Package / Case:256-BGA, Operating Temperature:0°C~85°C TJ, LFE2M20SE-5FN256C pinout, LFE2M20SE-5FN256C datasheet PDF, LFE2M20SE-5FN256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M20SE-5FN256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE2M20SE-5FN256C


FPGAs Lattice Semiconductor LFE2M20SE-5FN256C Overview

The LFE2M20SE-5FN256C from Lattice Semiconductor represents a state-of-the-art FPGA solution, designed to meet the versatile needs of modern electronics. This FPGA offers a robust platform for developing complex designs with its 140 I/O capabilities housed in a compact 256FBGA package. The adaptability of the LFE2M20SE-5FN256C makes it an ideal choice for designers seeking a mix of performance, power efficiency, and space-saving design. Perfect for applications requiring a flexible logic architecture, this device allows for rapid prototyping and adjustments in mid-development, reducing time to market and enhancing system reliability. The FPGAs Lattice Semiconductor LFE2M20SE-5FN256C is meticulously engineered to support scalable designs that cater to both low and high-volume requirements, making it highly appealing for B2B customers.

LFE2M20SE-5FN256C Features

The LFE2M20SE-5FN256C FPGA is equipped with numerous features that set it apart from competitors. Key attributes include its 256-pin Fine Ball Grid Array (FBGA) package, which ensures a minimal footprint on the circuit board while providing a substantial number of I/O ports. This device supports a variety of configuration memories and offers a single 3.3V power supply for simplified system integration. Additionally, the LFE2M20SE-5FN256C is characterized by its high performance and low power consumption, making it an environmentally friendly choice for energy-conscious applications.

LFE2M20SE-5FN256C Applications

  • Consumer Electronics: Utilized in devices such as digital cameras and gaming consoles, where the FPGA facilitates rapid data processing and enhances multimedia handling capabilities.
  • Industrial Automation: Employs its high I/O count and robustness to manage control systems and sensors in complex industrial environments, improving operational efficiency and reliability.
  • Automotive Applications: Critical in driver assistance systems (DAS), where its processing power supports functionalities like collision detection and parking assistance.
  • Telecommunications: Supports infrastructure for both wired and wireless communications, allowing for improved data flow management and system scalability.
  • Medical Devices: Used in diagnostic and imaging equipment, where precision and reliability are paramount, enhancing device functionality and patient safety.
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