LFE2M20E-6F256C

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Mfr.Part #
LFE2M20E-6F256C
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 140 I/O 256FBGA
Stock
14,294
In Stock :
14,294

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
2375
Peak Reflow Temperature (Cel) :
225
Published :
2008
Terminal Pitch :
1mm
Operating Temperature :
0°C~85°C TJ
Time@Peak Reflow Temperature-Max (s) :
30
Max Frequency :
357MHz
Height Seated (Max) :
2.1mm
Lead Free :
Lead Free
Number of I/O :
140
Voltage - Supply :
1.14V~1.26V
Series :
ECP2M
JESD-609 Code :
e0
Pbfree Code :
No
Reach Compliance Code :
not_compliant
Terminal Form :
Ball
HTS Code :
8542.39.00.01
Memory Size :
157.3kB
Number of Logic Elements/Cells :
19000
Number of Terminations :
256
ECCN Code :
EAR99
Length :
17mm
Mounting Type :
Surface Mount
Pin Count :
256
Base Part Number :
LFE2M20
Supply Voltage :
1.2V
Mount :
Surface Mount
Operating Supply Voltage :
1.2V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RoHS Status :
Non-RoHS Compliant
Width :
17mm
Qualification Status :
Not Qualified
Package / Case :
256-BGA
Number of Outputs :
140
RAM Size :
152.1kB
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Pins :
256
Terminal Finish :
Tin/Lead (Sn63Pb37)
Combinatorial Delay of a CLB-Max :
0.331 ns
Terminal Position :
BOTTOM
Packaging :
Tray
Number of Logic Cells :
20000
Total RAM Bits :
1246208
Datasheets
LFE2M20E-6F256C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M20E-6F256C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Number of Terminations:256, Mounting Type:Surface Mount, Base Part Number:LFE2M20, Package / Case:256-BGA, Number of Pins:256, LFE2M20E-6F256C pinout, LFE2M20E-6F256C datasheet PDF, LFE2M20E-6F256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M20E-6F256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE2M20E-6F256C


FPGAs Lattice Semiconductor LFE2M20E-6F256C Overview

The FPGAs Lattice Semiconductor LFE2M20E-6F256C is a highly versatile and efficient FPGA, designed to meet the demands of modern digital applications. Manufactured by Lattice Semiconductor, this device features a robust 256FBGA package that efficiently handles 140 I/O points, making it ideal for a wide range of applications. Its compact form factor and high functionality make it especially suitable for projects requiring a perfect balance between power and size. The use of advanced technology in the LFE2M20E-6F256C enhances system performance while reducing overall power consumption, providing a reliable platform for developers and engineers to innovate and optimize their systems.

LFE2M20E-6F256C Features

The LFE2M20E-6F256C from Lattice Semiconductor offers numerous features that make it an attractive choice for various applications. Key features include a large number of input/output options, a compact 256FBGA package that simplifies board-level design, and low-power consumption that extends the utility of battery-operated devices. Additionally, its programmable nature allows for flexibility and adaptability in rapidly changing tech environments, supporting a wide range of logic operations and configurations.

LFE2M20E-6F256C Applications

  • Consumer Electronics: Used in devices such as smartphones, tablets, and smart watches, the LFE2M20E-6F256C helps manage multiple I/O operations efficiently, ensuring smooth user experiences and robust functionality.
  • Automotive Applications: Integrates into driver assistance systems where its capacity to handle multiple inputs and outputs can be used for processing signals from sensors and cameras, enhancing vehicle safety and performance.
  • Industrial Automation: Ideal for control systems in manufacturing processes, where its ability to perform under rigorous conditions without sacrificing performance is critical for operational reliability.
  • Telecommunications: Deployed in communication infrastructure, where its high-speed I/O capabilities facilitate faster data transmission and processing, crucial for modern telecommunications networks.
  • Medical Devices: Utilized in medical imaging and diagnostic equipment, providing the necessary computational power and flexibility to handle complex algorithms required for detailed imaging and real-time data processing.
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