LFE2M100E-6F900C

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Mfr.Part #
LFE2M100E-6F900C
Manufacturer
Lattice Semiconductor
Package / Case
900-BBGA
Datasheet
Download
Description
IC FPGA 416 I/O 900FBGA
Stock
49,105
In Stock :
49,105

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Finish :
Tin/Lead (Sn63Pb37)
HTS Code :
8542.39.00.01
Operating Supply Voltage :
1.2V
Supply Voltage :
1.2V
Number of Logic Elements/Cells :
95000
Voltage - Supply :
1.14V~1.26V
Packaging :
Tray
Operating Temperature :
0°C~85°C TJ
Published :
2012
Reach Compliance Code :
not_compliant
Number of LABs/CLBs :
11875
Number of I/O :
416
Combinatorial Delay of a CLB-Max :
0.331 ns
Package / Case :
900-BBGA
Qualification Status :
Not Qualified
Lead Free :
Lead Free
RAM Size :
663.5kB
Terminal Pitch :
1mm
Width :
31mm
Mount :
Surface Mount
Pin Count :
900
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Position :
BOTTOM
Pbfree Code :
No
Base Part Number :
LFE2M100
JESD-609 Code :
e0
ECCN Code :
EAR99
Series :
ECP2M
Memory Size :
688.8kB
Height Seated (Max) :
2.6mm
Length :
31mm
RoHS Status :
Non-RoHS Compliant
Number of Outputs :
416
Max Frequency :
357MHz
Number of Pins :
900
Total RAM Bits :
5435392
Number of Logic Cells :
100000
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peak Reflow Temperature (Cel) :
225
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Form :
Ball
Number of Terminations :
900
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M100E-6F900C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Package / Case:900-BBGA, Mounting Type:Surface Mount, Base Part Number:LFE2M100, Number of Pins:900, Number of Terminations:900, LFE2M100E-6F900C pinout, LFE2M100E-6F900C datasheet PDF, LFE2M100E-6F900C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2M100E-6F900C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE2M100E-6F900C


FPGAs Lattice Semiconductor LFE2M100E-6F900C Overview

The FPGAs Lattice Semiconductor LFE2M100E-6F900C represents a high-performance FPGA (Field Programmable Gate Array) solution designed to meet the increasing demands of modern embedded systems. Manufactured by Lattice Semiconductor, this IC FPGA offers exceptional integration capabilities within a 900FBGA package, making it an ideal choice for applications requiring high I/O bandwidth and extensive programmability. Its ability to support complex digital systems while maintaining a compact and energy-efficient footprint allows designers to create more robust and adaptable products. By leveraging advanced technology, the LFE2M100E-6F900C enhances system performance with its versatile configuration options, tailored to address the rigorous requirements of high-speed data processing and complex algorithm implementations.

LFE2M100E-6F900C Features

The LFE2M100E-6F900C is equipped with 416 I/O pins, providing ample connectivity for diverse applications. Its 900FBGA packaging ensures a minimal footprint on the system board, optimizing board space without compromising performance. This FPGA is capable of facilitating complex, multi-functional designs due to its robust programmable logic capability, which allows for customization post-manufacturing, adding invaluable flexibility to product design cycles.

LFE2M100E-6F900C Applications

  • Telecommunications: Utilized in communication infrastructure, the LFE2M100E-6F900C manages signal processing and data flow efficiently, ensuring reliable and fast communications.
  • Industrial Automation: This FPGA is crucial in automating processes in manufacturing environments, where precision and adaptability to new protocols are key.
  • Consumer Electronics: Implemented in devices such as smartphones and tablets, the LFE2M100E-6F900C supports sophisticated user interfaces and high-speed data processing to enhance user experience.
  • Automotive Applications: Supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors to provide real-time responses, thereby increasing vehicle safety and functionality.
  • Medical Devices: In medical imaging systems, it processes complex algorithms necessary for high-resolution imaging techniques, improving diagnostic capabilities.
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