LFE2-70SE-7FN900C

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Mfr.Part #
LFE2-70SE-7FN900C
Manufacturer
Lattice Semiconductor
Package / Case
900-BBGA
Datasheet
Download
Description
IC FPGA 583 I/O 900FBGA
Stock
35,808
In Stock :
35,808

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
900-BBGA
Max Frequency :
420MHz
Operating Supply Voltage :
1.2V
Terminal Form :
Ball
Number of Outputs :
583
Qualification Status :
Not Qualified
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Series :
ECP2
Number of LABs/CLBs :
8500
Number of Terminations :
900
Number of Pins :
900
ECCN Code :
EAR99
Supply Voltage :
1.2V
Combinatorial Delay of a CLB-Max :
0.304 ns
Time@Peak Reflow Temperature-Max (s) :
30
Peak Reflow Temperature (Cel) :
250
Pbfree Code :
yes
Lead Free :
Lead Free
Published :
2012
Reach Compliance Code :
not_compliant
Voltage - Supply :
1.14V~1.26V
Number of I/O :
583
Total RAM Bits :
1056768
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RAM Size :
129kB
Number of Logic Elements/Cells :
68000
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Position :
BOTTOM
Mount :
Surface Mount
Operating Temperature :
0°C~85°C TJ
Height Seated (Max) :
2.6mm
Mounting Type :
Surface Mount
Width :
31mm
Memory Size :
146kB
Length :
31mm
Pin Count :
900
Number of Logic Cells :
70000
JESD-609 Code :
e1
HTS Code :
8542.39.00.01
Factory Lead Time :
8 Weeks
Terminal Pitch :
1mm
Base Part Number :
LFE2-70
RoHS Status :
ROHS3 Compliant
Packaging :
Tray
Datasheets
LFE2-70SE-7FN900C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2-70SE-7FN900C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:900-BBGA, Number of Terminations:900, Number of Pins:900, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Base Part Number:LFE2-70, LFE2-70SE-7FN900C pinout, LFE2-70SE-7FN900C datasheet PDF, LFE2-70SE-7FN900C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2-70SE-7FN900C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE2-70SE-7FN900C


FPGAs Lattice Semiconductor LFE2-70SE-7FN900C Overview

The LFE2-70SE-7FN900C from Lattice Semiconductor stands as a prominent figure in the FPGA (Field Programmable Gate Array) market, specifically designed to cater to advanced digital processing needs. This versatile FPGA is engineered to optimize performance in various high-demand applications, ensuring both flexibility and power efficiency. The integration of 583 I/O pins packaged in a compact 900FBGA makes it highly suitable for sophisticated electronic designs requiring a large number of I/O interfaces and substantial functionality within a small footprint. The robust configuration of the LFE2-70SE-7FN900C enables it to support intricate digital computations and signal processing tasks, making it an ideal choice for developers looking to push the boundaries of technology in their respective fields.

LFE2-70SE-7FN900C Features

This FPGA is equipped with a rich set of features that enhance its usability in complex electronic environments:

  • High I/O count with 583 programmable I/O pins, providing extensive connectivity options.
  • Advanced packaging technology with a 900FBGA format, ensuring high density and reliability.
  • Efficient power management capabilities that reduce operational costs and extend device longevity.
  • Support for high-speed digital processing, which is critical for real-time applications.

LFE2-70SE-7FN900C Applications

  • Telecommunications: The device can be used in router and switch designs, enhancing signal integrity and processing speed necessary for high-performance networking.
  • Consumer Electronics: Ideal for use in home entertainment systems such as smart TVs and gaming consoles, where multiple I/Os and high-speed processing enhance user experience.
  • Automotive: Suitable for automotive applications such as advanced driver-assistance systems (ADAS), where its processing power can handle real-time sensory and data analysis.
  • Industrial Automation: Employs its robust I/O capabilities in control systems and robotics, facilitating complex tasks and improving automation efficiency.
  • Medical Devices: Can be integrated into medical imaging systems, contributing to faster data processing and better image resolution.
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