LFE2-70SE-6FN900I

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Mfr.Part #
LFE2-70SE-6FN900I
Manufacturer
Lattice Semiconductor
Package / Case
900-BBGA
Datasheet
Download
Description
IC FPGA 583 I/O 900FBGA
Stock
17,171
In Stock :
17,171

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Max Frequency :
357MHz
Package / Case :
900-BBGA
Mounting Type :
Surface Mount
Combinatorial Delay of a CLB-Max :
0.331 ns
Terminal Pitch :
1mm
Length :
31mm
Number of I/O :
583
RAM Size :
129kB
HTS Code :
8542.39.00.01
Supply Voltage :
1.2V
Factory Lead Time :
8 Weeks
Peak Reflow Temperature (Cel) :
250
Height Seated (Max) :
2.6mm
Number of Pins :
900
Lead Free :
Lead Free
ECCN Code :
EAR99
Qualification Status :
Not Qualified
Time@Peak Reflow Temperature-Max (s) :
30
Memory Size :
146kB
Number of Outputs :
583
Number of LABs/CLBs :
8500
Pin Count :
900
Series :
ECP2
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Total RAM Bits :
1056768
Operating Temperature :
-40°C~100°C TJ
Number of Logic Elements/Cells :
68000
Terminal Position :
BOTTOM
Number of Terminations :
900
Number of Logic Cells :
70000
Voltage - Supply :
1.14V~1.26V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Published :
2008
Base Part Number :
LFE2-70
RoHS Status :
ROHS3 Compliant
Packaging :
Tray
Width :
31mm
JESD-609 Code :
e1
Operating Supply Voltage :
1.2V
Mount :
Surface Mount
Terminal Form :
Ball
Pbfree Code :
yes
Reach Compliance Code :
not_compliant
Datasheets
LFE2-70SE-6FN900I
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2-70SE-6FN900I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:900-BBGA, Mounting Type:Surface Mount, Number of Pins:900, Operating Temperature:-40°C~100°C TJ, Number of Terminations:900, Base Part Number:LFE2-70, LFE2-70SE-6FN900I pinout, LFE2-70SE-6FN900I datasheet PDF, LFE2-70SE-6FN900I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2-70SE-6FN900I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE2-70SE-6FN900I


FPGAs Lattice Semiconductor LFE2-70SE-6FN900I Overview

The FPGAs Lattice Semiconductor LFE2-70SE-6FN900I is a high-performance, feature-rich field programmable gate array (FPGA) designed to meet the complex and varying needs of modern electronics. This FPGA from Lattice Semiconductor is packaged in a dense 900FBGA form, providing a robust platform for the development of high-speed and flexible digital circuits. The LFE2-70SE-6FN900I is ideal for applications requiring extensive I/O capabilities, as it features 583 I/O pins, ensuring vast connectivity and configurability options. This versatility makes it a prime choice for developers aiming to rapidly prototype and deploy systems across various industries.

LFE2-70SE-6FN900I Features

The LFE2-70SE-6FN900I FPGA stands out with its extensive integration capabilities and advanced technology. It supports a wide range of digital and analog I/O standards, facilitating its use in a diverse set of applications. Its 900FBGA packaging ensures that despite its high I/O count, the device remains compact and suitable for space-constrained applications. Furthermore, the FPGA is designed for low-power consumption, making it an energy-efficient choice for energy-sensitive projects.

LFE2-70SE-6FN900I Applications

  • Communications Equipment: Integrates into routers, switches, and other network infrastructure to provide flexible, programmable logic for managing data flow and network operations.
  • Industrial Automation: Used in control systems and automation setups, enabling adaptable logic solutions for process management and machine control.
  • Consumer Electronics: Empowers developers to create customizable, high-performance logic solutions for multimedia devices, gaming consoles, and home automation systems.
  • Automotive Applications: Suitable for use in automotive infotainment systems and advanced driver-assistance systems (ADAS), providing the necessary processing power and connectivity options.
  • Medical Devices: Can be deployed in medical diagnostic equipment, such as imaging systems and patient monitoring, due to its ability to handle complex algorithms and data processing.
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