LFE2-70E-6FN672C

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Mfr.Part #
LFE2-70E-6FN672C
Manufacturer
Lattice Semiconductor
Package / Case
672-BBGA
Datasheet
Download
Description
IC FPGA 500 I/O 672FPBGA
Stock
34,827
In Stock :
34,827

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Peak Reflow Temperature (Cel) :
250
Width :
27mm
Time@Peak Reflow Temperature-Max (s) :
30
Qualification Status :
Not Qualified
Packaging :
Tray
Base Part Number :
LFE2-70
Lead Free :
Lead Free
Combinatorial Delay of a CLB-Max :
0.331 ns
Number of Logic Cells :
70000
Published :
2008
Pbfree Code :
yes
Clock Frequency :
357MHz
Length :
27mm
HTS Code :
8542.39.00.01
Number of Pins :
672
Number of I/O :
500
Terminal Form :
Ball
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code :
e1
Number of Terminations :
672
Total RAM Bits :
1056768
Mount :
Surface Mount
Reach Compliance Code :
not_compliant
Operating Supply Voltage :
1.2V
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Height Seated (Max) :
2.6mm
Voltage - Supply :
1.14V~1.26V
Supply Voltage :
1.2V
Number of Outputs :
500
Pin Count :
672
Terminal Pitch :
1mm
Package / Case :
672-BBGA
Number of Logic Elements/Cells :
68000
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Factory Lead Time :
8 Weeks
Memory Size :
146kB
Number of LABs/CLBs :
8500
Mounting Type :
Surface Mount
RAM Size :
129kB
Operating Temperature :
0°C~85°C TJ
RoHS Status :
ROHS3 Compliant
ECCN Code :
EAR99
Terminal Position :
BOTTOM
Series :
ECP2
Datasheets
LFE2-70E-6FN672C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2-70E-6FN672C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:LFE2-70, Number of Pins:672, Number of Terminations:672, Package / Case:672-BBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, LFE2-70E-6FN672C pinout, LFE2-70E-6FN672C datasheet PDF, LFE2-70E-6FN672C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2-70E-6FN672C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE2-70E-6FN672C


FPGAs Lattice Semiconductor LFE2-70E-6FN672C Overview

The Lattice Semiconductor LFE2-70E-6FN672C is a high-performance Field Programmable Gate Array (FPGA) designed to meet the intensive demands of modern digital applications. As part of Lattice Semiconductor's distinguished line of FPGAs, this component boasts substantial flexibility and is equipped to handle complex computational tasks efficiently. Ideal for designers and engineers looking to leverage speed and configurability, the LFE2-70E-6FN672C offers a robust solution in a 672-pin Fine Pitch Ball Grid Array (FPBGA) package. This FPGA excels in environments where space and power consumption are critical considerations, making it a preferred choice for cutting-edge electronic developments.

LFE2-70E-6FN672C Features

This device supports up to 500 user I/Os, providing ample connectivity for a multitude of peripherals and interfaces. Enhanced with a generous logic density and a flexible architecture, it allows for rapid prototyping and modifications. Such features ensure that the LFE2-70E-6FN672C is not only versatile but also adaptable to various performance requirements, ranging from basic logic control to complex algorithmic processing.

LFE2-70E-6FN672C Applications

  • Telecommunications Equipment: Utilized in routers and switches, the LFE2-70E-6FN672C helps manage data traffic efficiently and enhances bandwidth management capabilities.
  • Consumer Electronics: Applied in smart TVs and gaming consoles, this FPGA enables high-speed signal processing which is essential for supporting advanced graphics and user interface functionalities.
  • Automotive Applications: Critical in driver assistance systems, the FPGA processes inputs from multiple sensors simultaneously, aiding in real-time decision making and system responsiveness.
  • Industrial Automation: Used in control systems, the LFE2-70E-6FN672C optimizes operational processes and improves the reliability and efficiency of manufacturing systems.
  • Medical Devices: Integral to diagnostic and imaging equipment, it supports complex algorithms required for high-resolution image processing and real-time patient monitoring.
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