LFE2-6E-6FN256C
- Mfr.Part #
- LFE2-6E-6FN256C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 190 I/O 256FBGA
- Stock
- 7,390
- In Stock :
- 7,390
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Radiation Hardening :
- No
- Terminal Pitch :
- 1mm
- Number of Pins :
- 256
- Terminal Form :
- Ball
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Position :
- BOTTOM
- HTS Code :
- 8542.39.00.01
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Operating Temperature :
- 0°C~85°C TJ
- RAM Size :
- 6.9kB
- Mount :
- Surface Mount
- Factory Lead Time :
- 8 Weeks
- ECCN Code :
- EAR99
- Height Seated (Max) :
- 2.1mm
- RoHS Status :
- ROHS3 Compliant
- Number of Terminations :
- 256
- Lead Free :
- Lead Free
- Mounting Type :
- Surface Mount
- Number of Logic Elements/Cells :
- 6000
- Voltage - Supply :
- 1.14V~1.26V
- Length :
- 17mm
- Series :
- ECP2
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Memory Size :
- 8.4kB
- Packaging :
- Tray
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of I/O :
- 190
- Operating Supply Voltage :
- 1.2V
- Pbfree Code :
- yes
- Pin Count :
- 256
- Package / Case :
- 256-BGA
- Number of LABs/CLBs :
- 750
- Supply Voltage :
- 1.2V
- Base Part Number :
- LFE2-6
- Width :
- 17mm
- Combinatorial Delay of a CLB-Max :
- 0.331 ns
- JESD-609 Code :
- e1
- Clock Frequency :
- 357MHz
- Number of Outputs :
- 190
- Peak Reflow Temperature (Cel) :
- 250
- Published :
- 2008
- Total RAM Bits :
- 56320
- Datasheets
- LFE2-6E-6FN256C

FPGAs Lattice Semiconductor LFE2-6E-6FN256C Overview
The Lattice Semiconductor LFE2-6E-6FN256C is a highly capable FPGA (Field Programmable Gate Array) designed for versatility across a range of applications. This component is essential for developers looking for a balance between performance and cost. The LFE2-6E-6FN256C, part of Lattice's ECP2 series, offers a flexible solution that combines a rich feature set with a high-density packaging format (256FBGA), making it ideal for compact yet demanding applications. With its 190 programmable I/Os, this FPGA enables substantial interfacing capabilities, perfect for custom configurations and complex digital systems. The use of FPGAs Lattice Semiconductor LFE2-6E-6FN256C is pivotal in scenarios requiring rapid prototyping and iterative design due to its reprogrammable nature.
LFE2-6E-6FN256C Features
This FPGA boasts a host of features designed to enhance its usability and functionality in complex electronic environments. It includes support for high-speed serial communication, which is critical for data-intensive applications. The device also supports a range of voltage levels, providing flexibility for integration with existing hardware. Additionally, the 256FBGA package ensures a compact footprint while allowing for efficient thermal management, which is crucial in reducing system downtime and improving reliability.
LFE2-6E-6FN256C Applications
- Telecommunications: Employed in communication equipment, the LFE2-6E-6FN256C facilitates high-speed data processing and transfer capabilities essential for routers, switches, and base station development.
- Consumer Electronics: Integral to the design of consumer electronics, such as smart home devices, where its ability to handle multiple I/O operations simultaneously is crucial for multitasking functionality.
- Industrial Automation: This FPGA can be implemented in industrial control systems, enhancing the flexibility and speed of robotic process automation and monitoring systems.
- Automotive Applications: Suitable for use in automotive applications, particularly in the development of automotive infotainment systems and advanced driver-assistance systems (ADAS), where reliability and real-time processing are mandatory.
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