LFE2-50E-6FN484I

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Mfr.Part #
LFE2-50E-6FN484I
Manufacturer
Lattice Semiconductor
Package / Case
484-BBGA
Datasheet
Download
Description
IC FPGA 339 I/O 484FBGA
Stock
22,068
In Stock :
22,068

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Pin Count :
484
Height Seated (Max) :
2.6mm
Package / Case :
484-BBGA
Number of Logic Cells :
50000
Time@Peak Reflow Temperature-Max (s) :
30
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mount :
Surface Mount
Total RAM Bits :
396288
Length :
23mm
Number of Pins :
484
Number of LABs/CLBs :
6000
Combinatorial Delay of a CLB-Max :
0.331 ns
Mounting Type :
Surface Mount
Operating Temperature :
-40°C~100°C TJ
RAM Size :
48.4kB
Width :
23mm
Number of I/O :
339
JESD-609 Code :
e1
Factory Lead Time :
8 Weeks
Terminal Position :
BOTTOM
Supply Voltage :
1.2V
RoHS Status :
ROHS3 Compliant
Terminal Pitch :
1mm
Radiation Hardening :
No
Number of Logic Elements/Cells :
48000
Pbfree Code :
yes
Base Part Number :
LFE2-50
Lead Free :
Lead Free
Published :
2008
Operating Supply Voltage :
1.2V
Voltage - Supply :
1.14V~1.26V
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form :
Ball
Number of Terminations :
484
Series :
ECP2
Clock Frequency :
357MHz
Peak Reflow Temperature (Cel) :
250
Memory Size :
60.4kB
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
HTS Code :
8542.39.00.01
Number of Outputs :
339
Packaging :
Tray
ECCN Code :
EAR99
Datasheets
LFE2-50E-6FN484I
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2-50E-6FN484I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:484-BBGA, Number of Pins:484, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Base Part Number:LFE2-50, Number of Terminations:484, LFE2-50E-6FN484I pinout, LFE2-50E-6FN484I datasheet PDF, LFE2-50E-6FN484I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFE2-50E-6FN484I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFE2-50E-6FN484I


FPGAs Lattice Semiconductor LFE2-50E-6FN484I Overview

The LFE2-50E-6FN484I from Lattice Semiconductor represents a pinnacle of flexibility and efficiency in the FPGA (Field Programmable Gate Array) market. Designed to meet the rigorous demands of modern digital applications, this FPGA offers a versatile solution for designers looking to push the boundaries of hardware performance. With a robust 484-pin FBGA (Fine Ball Grid Array) packaging, this device ensures a compact footprint while delivering high-speed digital functionalities. Its ability to handle 339 I/O points makes it an exceptional choice for complex digital circuits, catering to both high performance and space-constrained applications. The FPGAs Lattice Semiconductor LFE2-50E-6FN484I is tailored for designers aiming for rapid deployment of their designs with a reconfigurable architecture that can easily adapt to evolving technical requirements.

LFE2-50E-6FN484I Features

  • 484FBGA package for reduced space utilization and enhanced performance.
  • 339 programmable I/O ports, providing ample flexibility for interfacing with other digital systems.
  • High configurability and adaptability, allowing for quick changes in functionality and optimization of the digital logic circuit.
  • Designed for low power consumption, aiding in more efficient system design.

LFE2-50E-6FN484I Applications

  • Consumer Electronics: Utilized in smart home devices, this FPGA can process multiple inputs and outputs efficiently, enhancing device responsiveness and functionality.
  • Telecommunications: Ideal for communications equipment where multiple data streams need to be managed and processed quickly to ensure seamless service delivery.
  • Automotive Systems: Plays a crucial role in automotive applications, such as driver assistance systems, where real-time data processing is critical for vehicle safety and performance.
  • Industrial Automation: Supports complex automation tasks in manufacturing processes, improving operational efficiency and system reliability.
  • Medical Devices: Used in medical imaging systems, ensuring quick data processing capabilities essential for high-resolution imaging and diagnostics.
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