LFE2-35E-5FN672C
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- Mfr.Part #
- LFE2-35E-5FN672C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 672-BBGA
- Datasheet
- Download
- Description
- IC FPGA 450 I/O 672FPBGA
- Stock
- 1,171
- In Stock ：
- 1,171
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Height Seated (Max) :
- 2.6mm
- Mounting Type :
- Surface Mount
- Series :
- ECP2
- Base Part Number :
- LFE2-35
- Voltage - Supply :
- 1.14V~1.26V
- Packaging :
- Tray
- Published :
- 2012
- Number of Logic Cells :
- 35000
- Terminal Pitch :
- 1mm
- Factory Lead Time :
- 8 Weeks
- ECCN Code :
- EAR99
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Package / Case :
- 672-BBGA
- Lead Free :
- Lead Free
- Supply Voltage :
- 1.2V
- RoHS Status :
- ROHS3 Compliant
- Width :
- 27mm
- Operating Supply Voltage :
- 1.2V
- Pin Count :
- 672
- Number of Terminations :
- 672
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Mount :
- Surface Mount
- Pbfree Code :
- yes
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RAM Size :
- 41.5kB
- Number of Logic Elements/Cells :
- 32000
- Number of Outputs :
- 450
- Combinatorial Delay of a CLB-Max :
- 0.358 ns
- Number of I/O :
- 450
- HTS Code :
- 8542.39.00.01
- Terminal Position :
- BOTTOM
- Peak Reflow Temperature (Cel) :
- 250
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Operating Temperature :
- 0°C~85°C TJ
- Total RAM Bits :
- 339968
- Clock Frequency :
- 311MHz
- JESD-609 Code :
- e1
- Number of LABs/CLBs :
- 4000
- Memory Size :
- 49.5kB
- Length :
- 27mm
- Terminal Form :
- Ball
- Radiation Hardening :
- No
- Number of Pins :
- 672
- Datasheets
- LFE2-35E-5FN672C
FPGAs Lattice Semiconductor LFE2-35E-5FN672C Overview
The FPGAs Lattice Semiconductor LFE2-35E-5FN672C represents a pinnacle of engineering in field programmable gate array technology. Developed by Lattice Semiconductor, this FPGA device offers high-performance versatility designed to meet the needs of a broad spectrum of applications. It boasts an impressive array of 450 I/O pins housed in a 672-pin fine-pitch BGA (ball grid array) package, ensuring robust connectivity and integration capabilities. The device's flexible architecture and enhanced logic density make it ideal for designers looking to push the boundaries of what's possible in their digital and mixed-signal applications. This product is a cornerstone in the development of innovative, responsive hardware solutions, encouraging B2B customers to scale their operations and accelerate product time-to-market with confidence.
LFE2-35E-5FN672C Features
This FPGA device is equipped with several key features that stand out in the semiconductor industry. The high count of 450 I/O pins enables extensive interface options with other peripherals and systems, critical for complex designs. The 672FPBGA packaging is designed for optimal thermal management and reduced footprint, making it suitable for densely packed PCBs. Additionally, the programmable nature of the FPGA allows for on-the-fly updates and reconfigurations, enhancing the device's flexibility and lifespan in dynamic technological environments.
LFE2-35E-5FN672C Applications
- Telecommunications Infrastructure: Integrates into networking hardware such as routers and switches to manage data flow efficiently.
- Automotive Electronics: Can be used in advanced driver-assistance systems (ADAS) for real-time sensor data processing.
- Consumer Electronics: Serves as the core processing unit in high-definition multimedia interfaces (HDMI) and video processing applications.
- Industrial Automation: Applies in control systems for real-time operational management and machine-to-machine communication.
- Aerospace and Defense: Employed in satellite communication systems and avionics for robust and secure data handling.
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