LE9662WQCT

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Mfr.Part #
LE9662WQCT
Manufacturer
Microchip Technology
Package / Case
56-VFQFN Exposed Pad
Datasheet
Download
Description
IC TELECOM INTERFACE 56QFN
Stock
38,185
In Stock :
38,185

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Manufacturer :
Microchip Technology
Product Category :
Telecom
Terminal Form :
NO LEAD
Mounting :
Surface Mount
JESD-30 Code :
S-XQCC-N56
Width :
8 mm
Interface :
4-Wire
Operating Supply Voltage :
3.3V
Supplier Device Package :
56-QFN (8x8)
Series :
miSLIC™
Terminal Pitch :
0.5 mm
Voltage - Supply :
3.135V~3.465V
Base Product Number :
LE9662
Terminal Position :
QUAD
Polarity Reversal :
No
Typical Operating Supply Voltage :
3.3 V
RoHS :
Compliant
Number of Channels per Chip :
2
Number of Terminals :
56
Package :
Tape and Reel (TR)
Subcategory :
Interface ICs
Pin Count :
56
Packaging :
Tape and Reel (TR)
Package / Case :
56-VFQFN Exposed Pad
Screening Level :
Industrial
Telecom IC Type :
SLIC
Current - Supply :
25mA
Length :
8 mm
Seated Height-Max :
1 mm
Brand :
Microchip Technology
Reach Compliance Code :
Unknown
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Surface Mount :
yes
Product Type :
Telecom Interface ICs
Function :
Subscriber Line Interface Concept (SLIC)
Product Category :
Telecom Interface ICs
On-Chip Ring Relay Driver :
No
Maximum Operating Supply Voltage :
3.465 Vdc
Temperature Grade :
Industrial
Package Shape :
Square
Supplier Package :
QFN EP
Manufacturer :
Microchip
Lifecycle Status :
IN PRODUCTION (Last Updated: 2 weeks ago)
RoHS Status :
ROHS3 Compliant
On-Hook Transmission :
yes
Mounting Type :
Surface Mount
Number of Circuits :
2
Min Supply Voltage (DC) :
3.135V
Number of Functions :
1
Factory Lead Time :
8 Weeks
Operating Supply Current :
25mA
Operating Temperature :
-40°C~85°C
Product Status :
Active
Minimum Operating Supply Voltage :
3.135 Vdc
Datasheets
LE9662WQCT
Introducing Telecom Microchip Technology LE9662WQCT from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:56-VFQFN Exposed Pad, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C, LE9662WQCT pinout, LE9662WQCT datasheet PDF, LE9662WQCT amp .Beyond Telecom Microchip Technology LE9662WQCT ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology LE9662WQCT


Telecom Microchip Technology LE9662WQCT Overview

The LE9662WQCT by Microchip Technology stands out in the telecom sector, offering robust interfacing solutions for communication applications. This Integrated Circuit (IC) is specifically designed to enhance the performance and reliability of telecom systems. The IC TELECOM INTERFACE 56QFN facilitates seamless integration into existing technology stacks, making it a versatile choice for manufacturers looking to upgrade or design telecom equipment. Its compact 56QFN package ensures minimal footprint while delivering optimal functionality, supporting large-scale deployments effectively.

LE9662WQCT Features

The LE9662WQCT IC offers a range of features suited for high-demand telecom applications. Key features include high integration capability that allows for reduced system complexity and increased reliability. The device is engineered to perform under the rigorous conditions typical in telecom environments, ensuring long-term stability and performance.

LE9662WQCT Applications

  • VoIP Systems: Integrates easily into Voice over IP technology to provide reliable voice transmission and reception, enhancing communication clarity and reducing latency.
  • PBX Systems: Utilized in Private Branch Exchange systems for efficient call routing and handling, improving the scalability and functionality of internal communication networks.
  • Telecom Switching: Essential in the operation of switching systems which require high reliability and performance consistency to manage multiple communications channels simultaneously.
This structured product description is designed to optimize on-page SEO and target B2B customers by highlighting the specific applications and capabilities of the LE9662WQCT, promoting its adoption in large-scale telecom projects.
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