LE89900AMC
- Mfr.Part #
- LE89900AMC
- Manufacturer
- Microchip Technology
- Package / Case
- MSOP
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 10MSOP
- Stock
- 42,881
- In Stock :
- 42,881
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- Manufacturer :
- Microchip Technology
- Product Category :
- Telecom
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Mounting Type :
- Surface Mount
- Series :
- -
- Package Type :
- MSOP
- RoHS Status :
- ROHS3 Compliant
- Current - Supply :
- -
- Package / Case :
- MSOP
- Packaging :
- Tube
- Lifecycle Status :
- OBSOLETE (Last Updated: 3 weeks ago)
- Package :
- Tube
- Number of Circuits :
- 1
- Interface :
- -
- Supplier Device Package :
- 10-MSOP
- Weight :
- 143.193441mg
- Operating Temperature :
- -
- Number of Channels :
- 2
- Voltage - Supply :
- -
- Product Status :
- Obsolete
- Function :
- TELECOM CIRCUIT
- Rad Hardened :
- No
- Datasheets
- LE89900AMC
Telecom device 1 Circuits
LE89900AMC Overview
Board space can be saved by using the MSOP package.For telecommunications equipment packing, the Tube method is used.Telecommunications equipment is mounted using Surface Mount.1 circuits are used in this telecom IC .When - is supplied wtelecom IC's efficiencyh power, efficiency can be improved.Using - as the operating temperature can result in reliable performance.The supply current is -.With the - series electronic parts, it can provide a lot of similar features.Flexibility is achieved through 2 channels.
LE89900AMC Features
Available in the MSOP package
LE89900AMC Applications
There are a lot of Microchip Technology
LE89900AMC Telecom applications.
- Digital Modems
- SONET/SDH terminal
- Add/Drop multiplexers (ADMs)
- T1/E1/J1 add/drop multiplexers (MUX)
- Channel Service Units (CSUs): T1/E1/J1
- Fractional T1/E1/J1
- BITS Timing
- Digital Access Cross-connect System (DACs)
- Digital Cross-connect Systems (DCS)
- Frame Relay Switches and Access Devices (FRADS)
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