LE75183BDSC

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Mfr.Part #
LE75183BDSC
Manufacturer
Microsemi
Package / Case
20-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC TELECOM INTERFACE 20SOIC
Stock
42,572
In Stock :
42,572

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Manufacturer :
Microsemi
Product Category :
Telecom
Supply Voltage :
5V
Operating Temperature :
-40°C~85°C
Terminal Finish :
MATTE TIN
Number of Pins :
20
JESD-609 Code :
e3
Qualification Status :
Not Qualified
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Telecom IC Type :
TELECOM CIRCUIT
Package / Case :
20-SOIC (0.295, 7.50mm Width)
Number of Circuits :
1
Number of Terminations :
20
Terminal Position :
Dual
Mounting Type :
Surface Mount
Packaging :
Tube
Function :
Line Card Access Switch
Terminal Form :
Gull wing
Height Seated (Max) :
2.65mm
Width :
7.5mm
Mount :
Surface Mount
RoHS Status :
RoHS Compliant
Voltage - Supply :
4.5V~5.5V
Datasheets
LE75183BDSC
Introducing Telecom Microsemi LE75183BDSC from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C, Number of Pins:20, Package / Case:20-SOIC (0.295, 7.50mm Width), Number of Terminations:20, Mounting Type:Surface Mount, LE75183BDSC pinout, LE75183BDSC datasheet PDF, LE75183BDSC amp .Beyond Telecom Microsemi LE75183BDSC ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi LE75183BDSC


Telecom Microsemi LE75183BDSC Overview

The Telecom Microsemi LE75183BDSC is a state-of-the-art integrated circuit designed for telecommunications interfaces, housed in a 20SOIC package. This IC is engineered by Microsemi, a leader in semiconductor technology, tailored specifically for high-performance telecom systems. The LE75183BDSC excels in delivering reliable and efficient functionality, making it an indispensable component for telecom applications where quality and durability are paramount. Its robust design is suited to manage various signal conditions, ensuring uninterrupted service and superior performance.

LE75183BDSC Features

The LE75183BDSC boasts a range of features that enhance its applicability in telecom environments. These include low power consumption which is crucial for sustainable operation, high signal integrity for clear communication, and enhanced durability to withstand rigorous operational demands. Additionally, its compatibility with a wide range of telecom standards ensures its versatility in various deployment scenarios.

LE75183BDSC Applications

  • Telecommunication Networks: Utilized in the backbone of both digital and analog signal processing, the LE75183BDSC ensures robust and reliable data transmission.
  • VoIP Systems: Perfect for Voice over IP (VoIP) applications, where it helps in converting and processing signals efficiently, maintaining clarity and quality of voice transmissions.
  • Modem Interfaces: Acts as a crucial component in modems, facilitating enhanced signal integrity and speed in internet connectivity tasks.
  • Wireless Communication Systems: Used in the signal chain of wireless infrastructure, supporting high-frequency operations and contributing to the overall efficiency of wireless communication systems.
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