LE58083ABGCT

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Mfr.Part #
LE58083ABGCT
Manufacturer
Microsemi
Package / Case
121-LFBGA
Datasheet
Download
Description
IC TELECOM INTERFACE 121BGA
Stock
9,586
In Stock :
9,586

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Manufacturer :
Microsemi
Product Category :
Telecom
RoHS Status :
Non-RoHS Compliant
Operating Temperature :
-40°C~85°C
Number of Circuits :
1
Packaging :
Tape and Reel (TR)
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
3.3V
Mounting Type :
Surface Mount
Supplier Device Package :
121-LFBGA (10x10)
Package / Case :
121-LFBGA
Interface :
PCI
Function :
Subscriber Line Interface Concept (SLIC)
Datasheets
LE58083ABGCT
Introducing Telecom Microsemi LE58083ABGCT from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C, Mounting Type:Surface Mount, Package / Case:121-LFBGA, LE58083ABGCT pinout, LE58083ABGCT datasheet PDF, LE58083ABGCT amp .Beyond Telecom Microsemi LE58083ABGCT ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.



Telecom device 1 Circuits

LE58083ABGCT Overview


In order to save space on the board, the 121-LFBGA package is used.Telecommunications equipment is packed using the Tape & Reel (TR) method.Mounting type Surface Mount is used.1 circuits make up this telecom IC .Telecom circuit is possible to increase efficiency by providing 3.3V with a higher voltage.At -40°C~85°C, reliable performance can be achieved.

LE58083ABGCT Features


Available in the 121-LFBGA package


LE58083ABGCT Applications


There are a lot of Microsemi Corporation
LE58083ABGCT Telecom applications.


  • Switches
  • LAN Routers
  • Digital Modems
  • SONET/SDH terminal
  • Add/Drop multiplexers (ADMs)
  • T1/E1/J1 add/drop multiplexers (MUX)
  • Channel Service Units (CSUs): T1/E1/J1
  • Fractional T1/E1/J1
  • BITS Timing
  • Digital Access Cross-connect System (DACs)
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