LCMXO2280E-3FTN324C

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Mfr.Part #
LCMXO2280E-3FTN324C
Manufacturer
Lattice Semiconductor
Package / Case
324-LBGA
Datasheet
Download
Description
IC FPGA 271 I/O 324FTBGA
Stock
14,276
In Stock :
14,276

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Published :
2009
Time@Peak Reflow Temperature-Max (s) :
40
Terminal Position :
BOTTOM
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Lead Free :
Lead Free
Supply Voltage :
1.2V
Max Frequency :
500MHz
Number of LABs/CLBs :
285
Operating Temperature :
0°C~85°C TJ
Nominal Supply Current :
20mA
Number of Terminations :
324
Width :
19mm
Number of Macro Cells :
1140
Propagation Delay :
5.1 ns
Total RAM Bits :
28262
JESD-609 Code :
e1
Base Part Number :
LCMXO2280
Operating Supply Voltage :
1.2V
Peak Reflow Temperature (Cel) :
260
Pin Count :
324
Pbfree Code :
yes
Qualification Status :
Not Qualified
ECCN Code :
EAR99
Voltage - Supply :
1.14V~1.26V
Mount :
Surface Mount
Number of Outputs :
271
Packaging :
Tray
Memory Type :
SRAM
Number of Logic Elements/Cells :
2280
Number of I/O :
271
Height Seated (Max) :
1.7mm
Mounting Type :
Surface Mount
Programmable Logic Type :
FLASH PLD
Number of Dedicated Inputs :
7
Number of Pins :
324
Operating Supply Current :
20mA
Package / Case :
324-LBGA
Reach Compliance Code :
not_compliant
Terminal Form :
Ball
HTS Code :
8542.39.00.01
Length :
19mm
Series :
MachXO
Terminal Pitch :
1mm
Factory Lead Time :
8 Weeks
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
RoHS Status :
ROHS3 Compliant
Output Function :
MACROCELL
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LCMXO2280E-3FTN324C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Number of Terminations:324, Base Part Number:LCMXO2280, Mounting Type:Surface Mount, Number of Pins:324, Package / Case:324-LBGA, LCMXO2280E-3FTN324C pinout, LCMXO2280E-3FTN324C datasheet PDF, LCMXO2280E-3FTN324C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LCMXO2280E-3FTN324C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LCMXO2280E-3FTN324C


FPGAs Lattice Semiconductor LCMXO2280E-3FTN324C Overview

The FPGAs Lattice Semiconductor LCMXO2280E-3FTN324C is a high-performance, field-programmable gate array designed for flexibility and integration. Manufactured by Lattice Semiconductor, a leader in low power programmable technology, this IC features 271 I/O pins housed in a 324FTBGA package, making it exceptionally versatile for various high-tech applications. Its robust design and adaptability make it ideal for developers looking to push the boundaries of hardware acceleration and smart computing solutions. The ability to program and reprogram functionalities post-production is critical in rapidly evolving tech landscapes, positioning this FPGA as a go-to choice for innovative system designs.

LCMXO2280E-3FTN324C Features

The LCMXO2280E-3FTN324C FPGA is equipped with a range of features that underscore its utility in complex electronic systems. Key features include a large number of input/output pins, which provide ample flexibility for interfacing with a wide variety of digital and analog components. Additionally, its BGA (Ball Grid Array) packaging ensures a reliable and robust physical connection, enhancing the overall durability and longevity of the product. This FPGA also supports multiple configuration options, enabling system designers to optimize their designs for speed, power efficiency, or a combination of both depending on the application requirements.

LCMXO2280E-3FTN324C Applications

  • Consumer Electronics: Integrated in devices such as smart TVs and gaming consoles to handle complex image processing and enhance user interface responsiveness.
  • Industrial Automation: Utilized in control systems for real-time processing and monitoring, improving efficiency and safety in manufacturing processes.
  • Automotive Systems: Deployed in advanced driver-assistance systems (ADAS) to process inputs from multiple sensors for vehicle safety enhancements.
  • Telecommunications: Used in network equipment to manage data flow and signal integrity, ensuring high-speed communication and reliability.
  • Medical Devices: Applied in medical imaging equipment to facilitate complex computational tasks, thus improving the accuracy and speed of diagnostics.
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