LCMXO2280C-3FTN256I

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Mfr.Part #
LCMXO2280C-3FTN256I
Manufacturer
Lattice Semiconductor
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 211 I/O 256FTBGA
Stock
1,447
In Stock :
1,447

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Pbfree Code :
yes
Operating Supply Current :
23mA
JESD-609 Code :
e1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peak Reflow Temperature (Cel) :
260
Number of I/O :
211
ECCN Code :
EAR99
Number of LABs/CLBs :
285
Additional Feature :
IT CAN ALSO OPERATE AT 2.5V AND 3.3V
Radiation Hardening :
No
Total RAM Bits :
28262
Frequency :
420MHz
Nominal Supply Current :
23mA
RoHS Status :
ROHS3 Compliant
Mount :
Surface Mount
Memory Type :
SRAM
Turn On Delay Time :
5.1 ns
Pin Count :
256
Number of Pins :
256
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Lead Free :
Lead Free
Voltage - Supply :
1.71V~3.465V
Length :
17mm
Number of Outputs :
211
Terminal Pitch :
1mm
Width :
17mm
Package / Case :
256-LBGA
Published :
2000
Series :
MachXO
HTS Code :
8542.39.00.01
REACH SVHC :
No SVHC
Height Seated (Max) :
1.55mm
Programmable Logic Type :
FLASH PLD
Time@Peak Reflow Temperature-Max (s) :
40
Factory Lead Time :
8 Weeks
Output Function :
MACROCELL
Number of Macro Cells :
1140
Terminal Form :
Ball
Number of Logic Elements/Cells :
2280
Packaging :
Tray
Number of Dedicated Inputs :
7
Base Part Number :
LCMXO2280
Number of Terminations :
256
Mounting Type :
Surface Mount
Operating Supply Voltage :
3.3V
Operating Temperature :
-40°C~100°C TJ
Propagation Delay :
5.1 ns
Supply Voltage :
1.8V
Terminal Position :
BOTTOM
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LCMXO2280C-3FTN256I from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:256, Package / Case:256-LBGA, Base Part Number:LCMXO2280, Number of Terminations:256, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, LCMXO2280C-3FTN256I pinout, LCMXO2280C-3FTN256I datasheet PDF, LCMXO2280C-3FTN256I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LCMXO2280C-3FTN256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LCMXO2280C-3FTN256I


FPGAs Lattice Semiconductor LCMXO2280C-3FTN256I Overview

The FPGAs Lattice Semiconductor LCMXO2280C-3FTN256I is a high-performance, field-programmable gate array designed for a wide range of digital signal processing and complex logic applications. Engineered by Lattice Semiconductor, this FPGA offers a versatile solution for designers looking to leverage speed and functionality in their circuit designs. The compact form factor of the 256FTBGA package allows for seamless integration into space-constrained environments, making it an ideal choice for sophisticated electronic systems. This product stands out in the market due to its robust I/O capabilities and the ability to handle high-density logic operations efficiently.

LCMXO2280C-3FTN256I Features

The LCMXO2280C-3FTN256I FPGA boasts an impressive array of features, including 211 user I/Os, which provide extensive interfacing capabilities. The device operates within a -40°C to 85°C temperature range, ensuring reliability under extreme conditions. With its support for non-volatile configuration memory, this FPGA offers designers the advantage of lower power consumption and increased performance stability. Its compatibility with multiple design software platforms also ensures a smooth design process, adaptable to various development needs.

LCMXO2280C-3FTN256I Applications

  • Consumer Electronics: Utilized in smart home devices and entertainment systems to manage complex user interfaces and connectivity.
  • Automotive Systems: Employs its high I/O count and robust temperature range to support advanced driver-assistance systems (ADAS) and in-vehicle infotainment.
  • Industrial Automation: Ideal for controlling machinery, processing sensor data, and enhancing real-time decision-making capabilities.
  • Telecommunications: Supports infrastructure for data processing and signal conditioning in communication hardware.
  • Medical Devices: Applied in medical imaging systems and diagnostic equipment for real-time processing capabilities.
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