LCMXO2-7000ZE-2FTG256C

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Mfr.Part #
LCMXO2-7000ZE-2FTG256C
Manufacturer
Lattice Semiconductor
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 206 I/O 256FTBGA
Stock
29,030
In Stock :
29,030

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
256-LBGA
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Base Part Number :
LCMXO2-7000
Number of LABs/CLBs :
858
Mount :
Surface Mount
Reach Compliance Code :
not_compliant
Time@Peak Reflow Temperature-Max (s) :
30
Operating Supply Current :
189μA
Lead Free :
Lead Free
Supply Voltage :
1.2V
Operating Temperature :
0°C~85°C TJ
Length :
17mm
Pbfree Code :
yes
Series :
MachXO2
Total RAM Bits :
245760
Qualification Status :
Not Qualified
Voltage - Supply :
1.14V~1.26V
Terminal Form :
Ball
Number of Pins :
256
Published :
2000
Number of Terminations :
256
Number of Logic Elements/Cells :
6864
RoHS Status :
ROHS3 Compliant
Number of Outputs :
207
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
ECCN Code :
EAR99
Mounting Type :
Surface Mount
Height Seated (Max) :
1.55mm
Packaging :
Tray
Memory Size :
68.8kB
Number of Macro Cells :
3432
Peak Reflow Temperature (Cel) :
260
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Factory Lead Time :
8 Weeks
Operating Supply Voltage :
1.2V
Terminal Position :
BOTTOM
Max Frequency :
125MHz
Terminal Pitch :
1mm
Width :
17mm
HTS Code :
8542.39.00.01
JESD-609 Code :
e1
Number of I/O :
206
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LCMXO2-7000ZE-2FTG256C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Base Part Number:LCMXO2-7000, Operating Temperature:0°C~85°C TJ, Number of Pins:256, Number of Terminations:256, Mounting Type:Surface Mount, LCMXO2-7000ZE-2FTG256C pinout, LCMXO2-7000ZE-2FTG256C datasheet PDF, LCMXO2-7000ZE-2FTG256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LCMXO2-7000ZE-2FTG256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LCMXO2-7000ZE-2FTG256C


FPGAs Lattice Semiconductor LCMXO2-7000ZE-2FTG256C Overview

The FPGAs Lattice Semiconductor LCMXO2-7000ZE-2FTG256C is a highly versatile and capable FPGA designed for a variety of applications that require high-speed logic operations and flexible integration capabilities. Manufactured by Lattice Semiconductor, a leader in low-power programmable logic, this IC offers a powerful combination of speed, efficiency, and I/O capabilities in a compact 256FTBGA package. Its robust design enables it to operate efficiently in dense configurations, making it an ideal choice for designers looking for a blend of performance and power economy. As a key component in your next-generation electronic designs, the FPGAs Lattice Semiconductor LCMXO2-7000ZE-2FTG256C guarantees reliability and high performance.

LCMXO2-7000ZE-2FTG256C Features

This FPGA model boasts 206 user I/Os, making it highly adaptable for various interfacing requirements. It supports a wide range of design implementations, aided by its flexible programmable fabric and high-density I/O configuration. The device is housed in a 256-pin Fine-pitch BGA (FTBGA) package, providing a compact form factor that is beneficial for space-constrained applications. Furthermore, its enhanced performance at low power consumption makes it particularly suitable for portable and power-sensitive applications.

LCMXO2-7000ZE-2FTG256C Applications

  • Consumer Electronics: Utilized in devices such as smart TVs and gaming consoles to manage signal processing tasks efficiently, enhancing user interface and experience.
  • Industrial Automation: Employs its robust I/O capabilities in control systems, facilitating complex machine-to-machine communications and real-time processing.
  • Automotive Systems: Critical in managing functions such as sensor data integration and real-time vehicle monitoring, contributing to smarter, safer driving technologies.
  • Communication Infrastructure: Used in networking equipment, improving data flow management and system reliability in high-demand communication environments.
  • Medical Devices: Helps in the development of advanced diagnostic and monitoring equipment, ensuring reliable operation and precision in medical applications.
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