LCMXO1200E-3BN256C

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Mfr.Part #
LCMXO1200E-3BN256C
Manufacturer
Lattice Semiconductor
Package / Case
256-LFBGA, CSPBGA
Datasheet
Download
Description
IC FPGA 211 I/O 256CABGA
Stock
18,302
In Stock :
18,302

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Pbfree Code :
yes
Width :
14mm
Number of LABs/CLBs :
150
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
0°C~85°C TJ
Mounting Type :
Surface Mount
Package / Case :
256-LFBGA, CSPBGA
Time@Peak Reflow Temperature-Max (s) :
40
Published :
2000
JESD-609 Code :
e1
Number of Dedicated Inputs :
7
Factory Lead Time :
8 Weeks
Number of Outputs :
211
RoHS Status :
ROHS3 Compliant
Propagation Delay :
5.1 ns
Reach Compliance Code :
not_compliant
Output Function :
MACROCELL
Terminal Pitch :
0.8mm
Length :
14mm
Pin Count :
256
Voltage - Supply :
1.14V~1.26V
Series :
MachXO
Clock Frequency :
420MHz
Number of Inputs :
211
Nominal Supply Current :
18mA
Number of Terminations :
256
Operating Supply Voltage :
1.2V
Qualification Status :
Not Qualified
Height Seated (Max) :
1.7mm
ECCN Code :
EAR99
JESD-30 Code :
S-PBGA-B256
Lead Free :
Lead Free
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Number of Macro Cells :
600
Terminal Position :
BOTTOM
Operating Supply Current :
18mA
HTS Code :
8542.39.00.01
Memory Type :
SRAM
Base Part Number :
LCMXO1200
Number of I/O :
211
Packaging :
Tray
Programmable Logic Type :
FLASH PLD
Total RAM Bits :
9421
Peak Reflow Temperature (Cel) :
260
Terminal Form :
Ball
Mount :
Surface Mount
Supply Voltage :
1.2V
Number of Logic Elements/Cells :
1200
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LCMXO1200E-3BN256C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Package / Case:256-LFBGA, CSPBGA, Number of Terminations:256, Base Part Number:LCMXO1200, LCMXO1200E-3BN256C pinout, LCMXO1200E-3BN256C datasheet PDF, LCMXO1200E-3BN256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LCMXO1200E-3BN256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LCMXO1200E-3BN256C


FPGAs Lattice Semiconductor LCMXO1200E-3BN256C Overview

The FPGAs Lattice Semiconductor LCMXO1200E-3BN256C represents a highly versatile and efficient solution for a variety of complex digital applications. Manufactured by Lattice Semiconductor, a leader in low-power programmable logic solutions, this FPGA device is tailored for performance-driven applications that require a high level of integration. The LCMXO1200E-3BN256C offers a seamless blend of power efficiency and functional density, making it an ideal choice for designers looking to optimize their systems with flexible, scalable, and cost-effective programmable logic devices.

LCMXO1200E-3BN256C Features

The LCMXO1200E-3BN256C FPGA boasts 211 user I/Os and comes in a compact 256-ball CABGA (Chip Array Ball Grid Array) package. This device is engineered to support a wide range of configuration options, providing enhanced flexibility in hardware design. It is designed for low-power consumption, making it suitable for power-sensitive applications. Additionally, the high I/O count and robust configuration capabilities allow for extensive versatility in complex digital circuits.

LCMXO1200E-3BN256C Applications

  • Consumer Electronics: Used in devices such as smart TVs and gaming consoles, the LCMXO1200E-3BN256C allows for rapid processing and handling of complex user interfaces and multi-media processing tasks.
  • Industrial Automation: Implements control systems and process automation for real-time operations, improving reliability and efficiency in manufacturing environments.
  • Automotive Applications: Supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors to enhance vehicle safety and functionality.
  • Telecommunications: Employed in network infrastructure to manage data flow and signal processing, ensuring high-speed and reliable communication.
  • Medical Devices: Integral in the development of portable medical diagnostics and imaging equipment, providing necessary computational power and connectivity.
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