LCMXO1200E-3B256C
- Mfr.Part #
- LCMXO1200E-3B256C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC FPGA 211 I/O 256CABGA
- Stock
- 8,187
- In Stock :
- 8,187
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- ECCN Code :
- EAR99
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Series :
- MachXO
- Nominal Supply Current :
- 18mA
- Memory Type :
- SRAM
- Lead Free :
- Lead Free
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Published :
- 2013
- RoHS Status :
- Non-RoHS Compliant
- JESD-30 Code :
- S-PBGA-B256
- Number of Logic Elements/Cells :
- 1200
- Programmable Logic Type :
- FLASH PLD
- Width :
- 14mm
- Number of Dedicated Inputs :
- 7
- Total RAM Bits :
- 9421
- Supply Voltage :
- 1.2V
- Pbfree Code :
- No
- Operating Supply Current :
- 18mA
- Operating Supply Voltage :
- 1.2V
- Number of Outputs :
- 211
- Propagation Delay :
- 5.1 ns
- Terminal Form :
- Ball
- Operating Temperature :
- 0°C~85°C TJ
- Voltage - Supply :
- 1.14V~1.26V
- JESD-609 Code :
- e0
- Height Seated (Max) :
- 1.7mm
- Output Function :
- MACROCELL
- Number of Macro Cells :
- 600
- Peak Reflow Temperature (Cel) :
- 240
- Mount :
- Surface Mount
- Pin Count :
- 256
- Number of Terminations :
- 256
- Mounting Type :
- Surface Mount
- Number of Inputs :
- 211
- Number of LABs/CLBs :
- 150
- Clock Frequency :
- 420MHz
- Length :
- 14mm
- Packaging :
- Tray
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Terminal Position :
- BOTTOM
- Base Part Number :
- LCMXO1200
- Reach Compliance Code :
- not_compliant
- Qualification Status :
- Not Qualified
- HTS Code :
- 8542.39.00.01
- Package / Case :
- 256-LFBGA, CSPBGA
- Terminal Pitch :
- 0.8mm
- Number of I/O :
- 211
- Datasheets
- LCMXO1200E-3B256C

FPGAs Lattice Semiconductor LCMXO1200E-3B256C Overview
The FPGAs Lattice Semiconductor LCMXO1200E-3B256C is a highly capable FPGA (Field Programmable Gate Array) designed to meet the rigorous demands of modern electronic applications. Manufactured by Lattice Semiconductor, this device features a compact 256-ball CABGA (Chip Array Ball Grid Array) package that accommodates 211 I/Os, providing ample flexibility for various design integrations. The FPGA is engineered for developers looking for a scalable, high-performance solution that supports rapid prototyping and versatile deployments across a wide range of industries. This overview emphasizes the robust adaptability and performance of the FPGAs Lattice Semiconductor LCMXO1200E-3B256C, making it an excellent choice for enterprises aiming to enhance their technological infrastructure.
LCMXO1200E-3B256C Features
This FPGA is not only compact but also rich in features that facilitate development and deployment across various applications. It boasts a significant number of I/O pins, high-speed performance capabilities, and a flexible programming environment suitable for complex circuit designs. The small form factor significantly reduces overall footprint while maintaining high functionality and reliability.
LCMXO1200E-3B256C Applications
- Consumer Electronics: Utilized in devices such as smart watches and gaming consoles, where space is at a premium but high performance is required.
- Automotive Applications: Integral for managing complex automotive control systems that require multiple input/output operations and real-time processing.
- Industrial Automation: Serves as the brain behind robotics and automated machinery, offering the necessary computational power and connectivity to handle multiple sensors and actuators.
- Telecommunications: Used in network equipment where high data throughput and reliable operation are critical for system performance and connectivity.
- Medical Devices: Employs advanced signal processing capabilities essential for medical imaging and diagnostic equipment, ensuring accurate and reliable results.
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