LCMXO1200C-4BN256C
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- Mfr.Part #
- LCMXO1200C-4BN256C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC FPGA 211 I/O 256CABGA
- Stock
- 101
- In Stock ：
- 101
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Package / Case :
- 256-LFBGA, CSPBGA
- JESD-30 Code :
- S-PBGA-B256
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Operating Supply Current :
- 21mA
- Height Seated (Max) :
- 1.7mm
- Operating Temperature :
- 0°C~85°C TJ
- RoHS Status :
- ROHS3 Compliant
- Qualification Status :
- Not Qualified
- Terminal Pitch :
- 0.8mm
- Nominal Supply Current :
- 21mA
- ECCN Code :
- EAR99
- Memory Type :
- SRAM
- Number of Inputs :
- 211
- Reach Compliance Code :
- not_compliant
- JESD-609 Code :
- e1
- Base Part Number :
- LCMXO1200
- Mounting Type :
- Surface Mount
- Number of Dedicated Inputs :
- 7
- Width :
- 14mm
- Output Function :
- MACROCELL
- Number of Macro Cells :
- 600
- Length :
- 14mm
- Mount :
- Surface Mount
- Series :
- MachXO
- Supply Voltage :
- 1.8V
- Number of Outputs :
- 211
- Lead Free :
- Lead Free
- Factory Lead Time :
- 8 Weeks
- Number of I/O :
- 211
- Clock Frequency :
- 420MHz
- Total RAM Bits :
- 9421
- Pbfree Code :
- yes
- Programmable Logic Type :
- FLASH PLD
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Voltage - Supply :
- 1.71V~3.465V
- Propagation Delay :
- 4.4 ns
- Operating Supply Voltage :
- 3.3V
- Published :
- 2000
- Additional Feature :
- IT CAN ALSO OPERATE AT 2.5V AND 3.3V
- Terminal Form :
- Ball
- Terminal Position :
- BOTTOM
- HTS Code :
- 8542.39.00.01
- Number of LABs/CLBs :
- 150
- Peak Reflow Temperature (Cel) :
- 260
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Packaging :
- Tray
- Number of Terminations :
- 256
- Pin Count :
- 256
- Number of Logic Elements/Cells :
- 1200
- Datasheets
- LCMXO1200C-4BN256C
FPGAs Lattice Semiconductor LCMXO1200C-4BN256C Overview
The LCMXO1200C-4BN256C from Lattice Semiconductor stands out in the market of Field Programmable Gate Arrays (FPGAs). Designed to offer a versatile and high-performance solution for a variety of complex digital applications, this FPGA integrates seamlessly into multiple designs with its compact 256-ball CABGA (chip-scale BGA) package. The device is optimized for low-power consumption while maintaining a high level of functional density, which makes it an ideal choice for developers looking to balance power and performance. With the capability to handle 211 I/Os, the LCMXO1200C-4BN256C provides ample flexibility for interfacing with other components in sophisticated electronic systems.
LCMXO1200C-4BN256C Features
- 211 programmable I/O pins allowing for extensive peripheral and interface diversity.
- Compact 256CABGA packaging for reduced board space and enhanced thermal performance.
- Optimized for low power consumption, suitable for battery-operated devices.
- Highly configurable logic blocks for tailor-made logic circuit design.
- Support for advanced memory interfacing, which provides greater design flexibility.
LCMXO1200C-4BN256C Applications
- Consumer Electronics: Utilized in smart home devices, the FPGA can manage multiple I/O operations seamlessly, enhancing device responsiveness and functionality.
- Industrial Automation: In manufacturing environments, this FPGA supports complex control systems and real-time processing for machinery and robotic applications.
- Automotive Applications: Integrates into automotive safety and control systems, enabling faster signal processing and increased reliability for critical functions.
- Telecommunications: Supports the demands of high-speed communication protocols, improving data transfer rates and network reliability in routers and switches.
- Medical Devices: Applied in medical imaging systems, it facilitates the rapid processing of complex algorithms required for high-resolution imaging.
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