JAN1N6123US

Manufacturer :

Microchip Technology

Product Category :

Terminal Form :

WRAP AROUND

Published :

1997

Lifecycle Status :

IN PRODUCTION (Last Updated: 3 weeks ago)

Mounting Type :

Surface Mount

Packaging :

Bulk

Series :

Military, MIL-PRF-19500/516

Direction :

Bidirectional

Voltage - Breakdown (Min) :

46.08V

Terminal Finish :

Tin/Lead (Sn/Pb)

Diode Element Material :

SILICON

Element Configuration :

Single

Mount :

Surface Mount

Time@Peak Reflow Temperature-Max (s) :

20

Number of Terminations :

2

JESD-609 Code :

e0

RoHS Status :

Non-RoHS Compliant

Contact Plating :

Lead, Tin

Pbfree Code :

No

Case Connection :

Isolated

Terminal Position :

END

Power - Peak Pulse :

500W

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

ECCN Code :

EAR99

Non-rep Peak Rev Power Dis-Max :

500W

Operating Temperature :

-55°C~175°C TJ

Type :

Zener

Bidirectional Channels :

1

Voltage - Reverse Standoff (Typ) :

38.8V

Rep Pk Reverse Voltage-Max :

38.8V

Power Line Protection :

No

Power Dissipation-Max :

5W

Package / Case :

SQ-MELF, B

Applications :

GENERAL PURPOSE

Voltage - Clamping (Max) @ Ipp :

73.61V

Peak Reflow Temperature (Cel) :

225

Current - Peak Pulse (10/1000μs) :

6.75A

Number of Pins :

2

Number of Elements :

1

Pin Count :

2

Qualification Status :

Qualified