JAN1N6122

Manufacturer :

Microchip Technology

Product Category :

Package / Case :

SQ-MELF, B

Element Configuration :

Single

Terminal Form :

WRAP AROUND

Case Connection :

Isolated

Peak Pulse Power :

500W

Max Reverse Leakage Current :

1μA

Qualification Status :

Qualified

Applications :

GENERAL PURPOSE

Factory Lead Time :

14 Weeks

Bidirectional Channels :

1

Pbfree Code :

No

Reverse Standoff Voltage :

35.8V

Peak Pulse Current :

7.7A

JESD-609 Code :

e0

Voltage - Breakdown (Min) :

32.47V

Published :

1997

Terminal Position :

END

Type :

Zener

Direction :

Bidirectional

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Power Line Protection :

No

Packaging :

Bulk

Peak Reflow Temperature (Cel) :

225

Number of Elements :

1

Test Current :

25mA

Terminal Finish :

Tin/Lead (Sn/Pb)

RoHS Status :

Non-RoHS Compliant

Diode Element Material :

SILICON

Operating Temperature :

-55°C~175°C TJ

Lifecycle Status :

IN PRODUCTION (Last Updated: 3 weeks ago)

Mounting Type :

Surface Mount

Number of Pins :

2

Current - Peak Pulse (10/1000μs) :

7.32A

Clamping Voltage :

64.6V

ECCN Code :

EAR99

Power Dissipation-Max :

5W

Number of Terminations :

2

Voltage - Clamping (Max) @ Ipp :

67.83V

Mount :

Surface Mount

Series :

Military, MIL-PRF-19500/516

Pin Count :

2

Time@Peak Reflow Temperature-Max (s) :

20

Voltage - Reverse Standoff (Typ) :

35.8V