IXDN409PI
- Mfr.Part #
- IXDN409PI
- Manufacturer
- Littelfuse
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC GATE DRVR LOW-SIDE 8DIP
- Stock
- 44,429
- In Stock :
- 44,429
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- Manufacturer :
- Littelfuse
- Product Category :
- Gate Drivers
- Time@Peak Reflow Temperature-Max (s) :
- 35
- Pin Count :
- 8
- Turn On Time :
- 0.04 µs
- Series :
- --
- Reach Compliance Code :
- not_compliant
- Fall Time (Typ) :
- 15 ns
- Nominal Supply Current :
- 3mA
- Surface Mount :
- No
- High Side Driver :
- No
- Terminal Position :
- Dual
- Width :
- 7.62mm
- Output Peak Current Limit-Nom :
- 9A
- Length :
- 9.59mm
- Current - Peak Output (Source, Sink) :
- 9A 9A
- Terminal Form :
- THROUGH-HOLE
- JESD-30 Code :
- R-PDIP-T8
- Gate Type :
- IGBT, N-Channel, P-Channel MOSFET
- JESD-609 Code :
- e3
- Mount :
- Through Hole
- Number of Functions :
- 1
- Supply Voltage :
- 18V
- Turn On Delay Time :
- 40 ps
- Terminal Finish :
- Matte Tin (Sn)
- Number of Pins :
- 8
- Output Current :
- 9A
- Qualification Status :
- Not Qualified
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- HTS Code :
- 8542.39.00.01
- Temperature Grade :
- Military
- Rise Time :
- 15ns
- Peak Reflow Temperature (Cel) :
- 260
- Weight :
- 599.989307mg
- Seated Height-Max :
- 4.57 mm
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Supplier Device Package :
- 8-PDIP
- Published :
- 2004
- Max Output Current :
- 9A
- Lead Free :
- Lead Free
- Channel Type :
- Single
- Turn Off Time :
- 0.036 μs
- Number of Terminations :
- 8
- Logic Voltage - VIL, VIH :
- 0.8V 3.5V
- Height Seated (Max) :
- 4.57mm
- Package :
- Tube
- Package Shape :
- RECTANGULAR
- ECCN Code :
- EAR99
- Input Type :
- Non-Inverting
- Number of Terminals :
- 8
- Operating Temperature :
- -55°C~150°C TJ
- Terminal Pitch :
- 2.54mm
- Propagation Delay :
- 40 ns
- Manufacturer :
- IXYS Corporation
- Voltage - Supply :
- 4.5V~35V
- Number of Drivers :
- 1
- Driven Configuration :
- Low-Side
- Mounting Type :
- Through Hole
- Base Part Number :
- IXD*409
- RoHS Status :
- RoHS Compliant
- Rise / Fall Time (Typ) :
- 10ns 10ns
- Packaging :
- Tube
- Product Status :
- Obsolete
- Base Product Number :
- IXDN409
- Interface IC Type :
- BUFFER OR INVERTER BASED MOSFET DRIVER
- Datasheets
- IXDN409PI

Gate Drivers Littelfuse IXDN409PI Overview
Introducing the Gate Drivers Littelfuse IXDN409PI, an essential component for professionals seeking robust and reliable low-side gate driving solutions. Manufactured by Littelfuse, this IC gate driver is designed to efficiently manage power and switching in electronic circuits. Encased in an 8DIP package, it offers a streamlined integration into existing layouts, making it an ideal choice for high-performance applications. Its ability to drive MOSFETs and IGBTs with precision ensures optimal functioning of your electronic assemblies, promoting enhanced system reliability and performance.
IXDN409PI Features
The IXDN409PI gate driver is packed with features designed for high-efficiency and durable operation. Key attributes include its low drive impedance and fast switching capabilities, which help in reducing transition losses. The device also supports a wide range of input logic levels, making it versatile across various digital interfaces. Additionally, its built-in protection against over-current provides further reliability and safety, making it a trustworthy choice for critical applications.
IXDN409PI Applications
- Motor Control Systems: Utilizes its fast switching capabilities to enhance performance and efficiency in electric motor drivers.
- Power Converters: Provides reliable gate driving for MOSFETs and IGBTs used in DC-DC and AC-DC converters, ensuring stable operation.
- Renewable Energy Systems: Employs robust gate driving in solar inverters and wind turbine converters, optimizing energy conversion and grid performance.
- Automotive Applications: Drives components in electric vehicle powertrain systems, supporting advancements in automotive efficiency and emissions reductions.
- LED Lighting Systems: Used in high-power LED lighting setups, improving energy efficiency and reducing thermal footprint.
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