IS61VF51236A-7.5B3
- Mfr.Part #
- IS61VF51236A-7.5B3
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 18,998
- In Stock :
- 18,998
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Format :
- SRAM
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Additional Feature :
- PIPELINED ARCHITECTURE, FLOW-THROUGH
- Supply Current-Max :
- 0.25mA
- Length :
- 15mm
- Supply Voltage-Max (Vsup) :
- 2.625V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Package / Case :
- 165-TBGA
- Memory Density :
- 18874368 bit
- Packaging :
- Tray
- Terminal Position :
- BOTTOM
- Pin Count :
- 165
- Width :
- 13mm
- Access Time :
- 7.5ns
- Standby Current-Max :
- 0.075A
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Voltage - Supply :
- 2.375V~2.625V
- Surface Mount :
- yes
- Number of Functions :
- 1
- Memory Width :
- 36
- Memory Interface :
- Parallel
- JESD-609 Code :
- e0
- Pbfree Code :
- No
- Memory Size :
- 18Mb 512K x 36
- HTS Code :
- 8542.32.00.41
- Power Supplies :
- 2.5V
- ECCN Code :
- 3A991.B.2.A
- Height Seated (Max) :
- 1.2mm
- Memory Type :
- Volatile
- Clock Frequency :
- 117MHz
- Supply Voltage :
- 2.5V
- Supply Voltage-Min (Vsup) :
- 2.375V
- Number of Pins :
- 165
- Standby Voltage-Min :
- 2.38V
- Qualification Status :
- Not Qualified
- Operating Temperature :
- -40°C~85°C TA
- Output Characteristics :
- 3-STATE
- Terminal Pitch :
- 1mm
- Organization :
- 512KX36
- Number of Terminations :
- 165
- I/O Type :
- COMMON
- Datasheets
- IS61VF51236A-7.5B3
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61VF51236A-7.5B3 Overview
The Memory Integrated Silicon Solution, Inc. (ISSI) IS61VF51236A-7.5B3 is a high-performance 18Mbit SRAM component, engineered with precision to deliver robust, reliable, and rapid memory solutions for demanding applications. Crafted in a compact 165TFBGA package, this IC is designed for parallel communication, making it an ideal choice for sophisticated electronic systems requiring high-speed data access and extensive memory capacity. This product's exceptional design and manufacturing by ISSI ensure that it meets the rigorous standards expected in professional electronics markets, making it an indispensable component for B2B customers looking to enhance their product offerings with superior memory solutions.
IS61VF51236A-7.5B3 Features
This SRAM chip offers a variety of features that make it a standout choice for integration into advanced electronics. Its high-speed operation at 7.5ns access time facilitates swift data processing, while the large 18Mbit capacity ensures ample storage for complex applications. The chip's parallel interface provides high bandwidth capabilities, which are crucial for applications that demand fast data throughput. Additionally, its compact 165TFBGA package allows for efficient use of PCB space, making it highly suitable for space-constrained applications.
IS61VF51236A-7.5B3 Applications
- Networking Equipment: Utilized in routers and switches for caching data, improving device responsiveness and handling extensive data loads efficiently.
- Telecommunication Infrastructure: Integrated into telecom systems for fast data buffering, enhancing signal processing capabilities essential for modern communication technologies.
- Automotive Electronics: Applied in advanced driver-assistance systems (ADAS) to provide high-speed data access, critical for real-time decision making and vehicle safety enhancements.
- Industrial Automation: Used in programmable logic controllers (PLCs) for managing operations data, thereby increasing the precision and speed of automated processes.
- Consumer Electronics: Deployed in high-performance gaming consoles and video equipment, where rapid access to large amounts of data is necessary to maintain seamless user experiences.
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