IS61VF102418A-6.5B3I
- Mfr.Part #
- IS61VF102418A-6.5B3I
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 22,712
- In Stock :
- 22,712
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Memory Density :
- 18874368 bit
- Clock Frequency :
- 133MHz
- Package / Case :
- 165-TBGA
- RoHS Status :
- ROHS3 Compliant
- Memory Size :
- 18Mb 1M x 18
- Standby Current-Max :
- 0.075A
- Terminal Position :
- BOTTOM
- I/O Type :
- COMMON
- Supply Voltage :
- 2.5V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Qualification Status :
- Not Qualified
- Voltage - Supply :
- 2.375V~2.625V
- Memory Width :
- 18
- Surface Mount :
- yes
- Pin Count :
- 165
- JESD-609 Code :
- e0
- Supply Voltage-Max (Vsup) :
- 2.625V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Output Characteristics :
- 3-STATE
- Standby Voltage-Min :
- 2.38V
- Additional Feature :
- FLOW-THROUGH ARCHITECTURE
- Number of Terminations :
- 165
- Mounting Type :
- Surface Mount
- Width :
- 13mm
- Supply Voltage-Min (Vsup) :
- 2.375V
- Pbfree Code :
- No
- Terminal Pitch :
- 1mm
- Memory Format :
- SRAM
- Number of Functions :
- 1
- Organization :
- 1MX18
- Packaging :
- Tray
- Access Time :
- 6.5ns
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Operating Temperature :
- -40°C~85°C TA
- ECCN Code :
- 3A991.B.2.A
- Supply Current-Max :
- 0.275mA
- Power Supplies :
- 2.5V
- HTS Code :
- 8542.32.00.41
- Length :
- 15mm
- Height Seated (Max) :
- 1.2mm
- Number of Pins :
- 165
- Memory Interface :
- Parallel
- Memory Type :
- Volatile
- Datasheets
- IS61VF102418A-6.5B3I
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61VF102418A-6.5B3I Overview
The Memory Integrated Silicon Solution, Inc. (ISSI) IS61VF102418A-6.5B3I is a high-performance 18Mbit SRAM device, designed for fast and reliable storage operations. Engineered using advanced technology, this IC offers a parallel interface with a 165TFBGA package for optimized footprint and thermal management. The robust design ensures high-speed data access and reliability, making it ideal for applications that require quick data retrieval and high throughput. Its low latency and high bandwidth capabilities make it a premium choice for sophisticated electronic systems that demand top-tier memory performance.
IS61VF102418A-6.5B3I Features
This SRAM module boasts several key features that enhance its usability in various applications:
- High capacity of 18Mbit for extensive data handling
- Parallel interface for rapid data transfer rates
- Compact 165TFBGA packaging ensures a reduced footprint while providing efficient heat dissipation
- Optimal design for low-power consumption enhances overall system efficiency
- Stable operation under a wide range of environmental conditions
IS61VF102418A-6.5B3I Applications
- Networking Equipment: Utilized in routers and switches for buffer memory, improving throughput and data integrity during high-volume network sessions.
- Telecommunications Systems: Serves as data buffer storage in telecommunications infrastructure, ensuring smooth and continuous data flow.
- Industrial Automation: Helps in managing real-time data processing in industrial control systems, facilitating quicker response times and enhanced process control.
- Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to quickly process and store sensor data, enhancing vehicle safety and performance.
- Consumer Electronics: Provides fast-access memory for high-performance gaming consoles and home entertainment systems, enabling richer, more immersive user experiences.
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