IS61VF102418A-6.5B3I

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Mfr.Part #
IS61VF102418A-6.5B3I
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165TFBGA
Stock
22,712
In Stock :
22,712

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Memory Density :
18874368 bit
Clock Frequency :
133MHz
Package / Case :
165-TBGA
RoHS Status :
ROHS3 Compliant
Memory Size :
18Mb 1M x 18
Standby Current-Max :
0.075A
Terminal Position :
BOTTOM
I/O Type :
COMMON
Supply Voltage :
2.5V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Qualification Status :
Not Qualified
Voltage - Supply :
2.375V~2.625V
Memory Width :
18
Surface Mount :
yes
Pin Count :
165
JESD-609 Code :
e0
Supply Voltage-Max (Vsup) :
2.625V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Output Characteristics :
3-STATE
Standby Voltage-Min :
2.38V
Additional Feature :
FLOW-THROUGH ARCHITECTURE
Number of Terminations :
165
Mounting Type :
Surface Mount
Width :
13mm
Supply Voltage-Min (Vsup) :
2.375V
Pbfree Code :
No
Terminal Pitch :
1mm
Memory Format :
SRAM
Number of Functions :
1
Organization :
1MX18
Packaging :
Tray
Access Time :
6.5ns
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Finish :
Tin/Lead (Sn/Pb)
Operating Temperature :
-40°C~85°C TA
ECCN Code :
3A991.B.2.A
Supply Current-Max :
0.275mA
Power Supplies :
2.5V
HTS Code :
8542.32.00.41
Length :
15mm
Height Seated (Max) :
1.2mm
Number of Pins :
165
Memory Interface :
Parallel
Memory Type :
Volatile
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61VF102418A-6.5B3I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-TBGA, Number of Terminations:165, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, Number of Pins:165, IS61VF102418A-6.5B3I pinout, IS61VF102418A-6.5B3I datasheet PDF, IS61VF102418A-6.5B3I amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61VF102418A-6.5B3I ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61VF102418A-6.5B3I


Memory Integrated Silicon Solution, Inc. (ISSI) IS61VF102418A-6.5B3I Overview

The Memory Integrated Silicon Solution, Inc. (ISSI) IS61VF102418A-6.5B3I is a high-performance 18Mbit SRAM device, designed for fast and reliable storage operations. Engineered using advanced technology, this IC offers a parallel interface with a 165TFBGA package for optimized footprint and thermal management. The robust design ensures high-speed data access and reliability, making it ideal for applications that require quick data retrieval and high throughput. Its low latency and high bandwidth capabilities make it a premium choice for sophisticated electronic systems that demand top-tier memory performance.

IS61VF102418A-6.5B3I Features

This SRAM module boasts several key features that enhance its usability in various applications:

  • High capacity of 18Mbit for extensive data handling
  • Parallel interface for rapid data transfer rates
  • Compact 165TFBGA packaging ensures a reduced footprint while providing efficient heat dissipation
  • Optimal design for low-power consumption enhances overall system efficiency
  • Stable operation under a wide range of environmental conditions

IS61VF102418A-6.5B3I Applications

  • Networking Equipment: Utilized in routers and switches for buffer memory, improving throughput and data integrity during high-volume network sessions.
  • Telecommunications Systems: Serves as data buffer storage in telecommunications infrastructure, ensuring smooth and continuous data flow.
  • Industrial Automation: Helps in managing real-time data processing in industrial control systems, facilitating quicker response times and enhanced process control.
  • Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to quickly process and store sensor data, enhancing vehicle safety and performance.
  • Consumer Electronics: Provides fast-access memory for high-performance gaming consoles and home entertainment systems, enabling richer, more immersive user experiences.
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