IS61QDB42M18C-333M3LI
- Mfr.Part #
- IS61QDB42M18C-333M3LI
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 165LFBGA
- Stock
- 23,920
- In Stock :
- 23,920
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Access Time :
- 8.4ns
- Terminal Position :
- BOTTOM
- RoHS Status :
- ROHS3 Compliant
- Number of Functions :
- 1
- Memory Format :
- SRAM
- Terminal Pitch :
- 1mm
- Clock Frequency :
- 333MHz
- HTS Code :
- 8542.32.00.41
- Number of Terminations :
- 165
- Voltage - Supply :
- 1.71V~1.89V
- Length :
- 17mm
- Mounting Type :
- Surface Mount
- Operating Temperature :
- -40°C~85°C TA
- Packaging :
- Tray
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Interface :
- Parallel
- Organization :
- 2MX18
- Memory Width :
- 18
- Supply Voltage :
- 1.8V
- Supply Voltage-Max (Vsup) :
- 1.89V
- JESD-30 Code :
- R-PBGA-B165
- Memory Type :
- Volatile
- Height Seated (Max) :
- 1.4mm
- Width :
- 15mm
- Surface Mount :
- yes
- Memory Size :
- 36Mb 2M x 18
- Package / Case :
- 165-LBGA
- Supply Voltage-Min (Vsup) :
- 1.71V
- Memory Density :
- 37748736 bit
- ECCN Code :
- 3A991.B.2.A
- Datasheets
- IS61QDB42M18C-333M3LI
Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB42M18C-333M3LI Overview
The IS61QDB42M18C-333M3LI from Integrated Silicon Solution, Inc. (ISSI) is a high-capacity, high-performance SRAM IC designed to meet the demanding requirements of advanced digital systems. This 36Mbit SRAM uses a parallel interface and is housed in a compact 165LFBGA package, making it ideal for applications where space and speed are critical. The Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB42M18C-333M3LI provides reliable and fast data storage and retrieval, facilitating improved system efficiency and responsiveness in a variety of industrial and commercial applications.
IS61QDB42M18C-333M3LI Features
This SRAM component features a 36Mbit capacity with a parallel interface, ensuring rapid access times that are essential for high-speed computing tasks. It operates over a wide industrial temperature range, making it suitable for use in environments subject to extreme conditions. The 165LFBGA package is not only space-efficient but also offers robust reliability under thermal stress, enhancing system longevity.
IS61QDB42M18C-333M3LI Applications
- Networking Equipment: Utilized in routers, switches, and other network infrastructure devices for buffer memory, which helps in managing data flow efficiently.
- Telecommunications Systems: Serves as high-speed transient data storage for telecommunications infrastructure, facilitating rapid data processing and exchange.
- Automotive Electronics: Employed in advanced driver-assistance systems (ADAS) where quick data retrieval is critical for real-time decision-making.
- Industrial Automation: Provides dependable, high-speed memory solutions for PLCs and other industrial control systems, enhancing operational efficiency and machine-to-machine communication.
- Medical Equipment: Used in medical imaging systems, such as CT and MRI, where large amounts of data need to be processed quickly and reliably.
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