IS61QDB41M36-250M3L
- Mfr.Part #
- IS61QDB41M36-250M3L
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 165LFBGA
- Stock
- 10,187
- In Stock :
- 10,187
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Standby Voltage-Min :
- 1.7V
- Clock Frequency :
- 250MHz
- Number of Ports :
- 2
- Time@Peak Reflow Temperature-Max (s) :
- 10
- Memory Type :
- Volatile
- Output Characteristics :
- 3-STATE
- Additional Feature :
- PIPELINED ARCHITECTURE
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Package / Case :
- 165-LBGA
- Terminal Position :
- BOTTOM
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of Terminations :
- 165
- Organization :
- 1MX36
- Number of Pins :
- 165
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Supply Voltage :
- 1.8V
- Height Seated (Max) :
- 1.7mm
- Supply Voltage-Max (Vsup) :
- 1.89V
- Supply Voltage :
- 1.8V
- Voltage - Supply :
- 1.71V~1.89V
- Memory Format :
- SRAM
- Supply Current-Max :
- 0.5mA
- Access Time :
- 7.5ns
- Word Size :
- 36b
- Radiation Hardening :
- No
- Memory Interface :
- Parallel
- Terminal Pitch :
- 1mm
- Peak Reflow Temperature (Cel) :
- 260
- Length :
- 17mm
- Pbfree Code :
- yes
- Address Bus Width :
- 19b
- Mount :
- Surface Mount
- Memory Size :
- 36Mb 1M x 36
- JESD-609 Code :
- e1
- Mounting Type :
- Surface Mount
- Number of Functions :
- 1
- Memory Width :
- 36
- I/O Type :
- Separate
- Pin Count :
- 165
- Supply Voltage-Min (Vsup) :
- 1.71V
- Operating Temperature :
- 0°C~70°C TA
- Sync/Async :
- SYNCHRONOUS
- Density :
- 36 Mb
- Datasheets
- IS61QDB41M36-250M3L
Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB41M36-250M3L Overview
The Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB41M36-250M3L is an advanced SRAM component designed for high-performance data storage and retrieval. This IC provides a substantial 36Mbit of storage capacity with a parallel interface, housed in a compact 165LFBGA package. Tailored for applications requiring fast access and high reliability, this SRAM device supports a wide range of industrial temperatures, making it an ideal choice for robust environments. Its low-latency and high-speed capabilities ensure it meets the critical demands of sophisticated electronic systems, enhancing overall system efficiency and reliability.
IS61QDB41M36-250M3L Features
This high-density SRAM features a parallel interface, offering high-speed data access. The 165LFBGA package is designed for efficient space utilization and enhanced thermal stability, which is critical for maintaining performance in variable operational conditions. Furthermore, its wide temperature range support makes it suitable for demanding industrial applications where durability is as important as performance.
IS61QDB41M36-250M3L Applications
- Networking Equipment: Utilized in routers and switches for fast data buffering, ensuring efficient packet management and throughput.
- High-performance Computing: Serves as cache memory in servers and workstations, enabling quick data retrieval to cope with high-speed computing tasks.
- Telecommunications: Deployed in telecommunications infrastructure, where quick access to data is crucial for real-time signal processing.
- Automotive Electronics: Used in advanced driver-assistance systems (ADAS) for fast data processing, helping to improve response times and reliability in critical situations.
- Industrial Automation: Provides dependable and quick access memory in automation controllers, facilitating improved process control and operational efficiency in manufacturing environments.
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