IS61QDB22M18C-250M3LI

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Mfr.Part #
IS61QDB22M18C-250M3LI
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165LFBGA
Stock
43,695
In Stock :
43,695

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
ECCN Code :
3A991.B.2.A
Access Time :
8.4ns
Number of Functions :
1
Supply Voltage-Min (Vsup) :
1.71V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-30 Code :
R-PBGA-B165
Operating Temperature :
-40°C~85°C TA
Number of Terminations :
165
Supply Voltage :
1.8V
Memory Size :
36Mb 2M x 18
Surface Mount :
yes
Memory Width :
18
Packaging :
Tray
Supply Voltage-Max (Vsup) :
1.89V
HTS Code :
8542.32.00.41
Memory Format :
SRAM
Clock Frequency :
250MHz
Package / Case :
165-LBGA
Memory Type :
Volatile
Length :
17mm
Mounting Type :
Surface Mount
Terminal Pitch :
1mm
Memory Density :
37748736 bit
Memory Interface :
Parallel
Organization :
2MX18
Width :
15mm
Height Seated (Max) :
1.4mm
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
1.71V~1.89V
Terminal Position :
BOTTOM
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18C-250M3LI from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Number of Terminations:165, Package / Case:165-LBGA, Mounting Type:Surface Mount, IS61QDB22M18C-250M3LI pinout, IS61QDB22M18C-250M3LI datasheet PDF, IS61QDB22M18C-250M3LI amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18C-250M3LI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18C-250M3LI


Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18C-250M3LI Overview

The Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18C-250M3LI is a high-performance 36Mbit SRAM chip designed for applications requiring rapid access and high data throughput. Manufactured by Integrated Silicon Solution, Inc., this IC features a parallel interface and is housed in a compact 165-pin LFBGA package, ensuring a minimal footprint along with robust performance. This SRAM is particularly suited for advanced industrial applications where speed and reliability are critical, offering an optimal balance between density and speed, with a clock frequency of 250 MHz for efficient processing and responsiveness.

IS61QDB22M18C-250M3LI Features

  • 36Mbit high-density SRAM provides ample storage for real-time data processing.
  • Parallel interface ensures quick data access and high-speed operations.
  • 165LFBGA package offers a compact form factor, ideal for space-constrained applications.
  • Operational frequency of 250 MHz allows for efficient data handling and throughput.
  • Low latency and high reliability make it suitable for critical and demanding applications.

IS61QDB22M18C-250M3LI Applications

  • Networking Equipment: Utilized in routers and switches for buffer memory, enhancing data flow and reducing latency.
  • Telecommunications: Employed in telecom infrastructure to manage real-time signal processing efficiently.
  • Automotive: Integral in advanced driver-assistance systems (ADAS) for rapid sensor data processing.
  • Industrial Automation: Facilitates high-speed operations in PLCs and industrial PCs, ensuring timely task execution.
  • Medical Devices: Used in medical imaging systems to handle large data volumes swiftly and reliably.
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