IS61QDB22M18C-250M3
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- Mfr.Part #
- IS61QDB22M18C-250M3
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 165LFBGA
- Stock
- 7,298
- In Stock ：
- 7,298
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Package / Case :
- 165-LBGA
- Memory Density :
- 37748736 bit
- Length :
- 17mm
- ECCN Code :
- 3A991.B.2.A
- HTS Code :
- 8542.32.00.41
- Voltage - Supply :
- 1.71V~1.89V
- Memory Width :
- 18
- Number of Terminations :
- 165
- Memory Format :
- SRAM
- Width :
- 15mm
- JESD-30 Code :
- R-PBGA-B165
- Surface Mount :
- yes
- RoHS Status :
- ROHS3 Compliant
- Terminal Pitch :
- 1mm
- Supply Voltage :
- 1.8V
- Memory Type :
- Volatile
- Organization :
- 2MX18
- Clock Frequency :
- 250MHz
- Supply Voltage-Max (Vsup) :
- 1.89V
- Supply Voltage-Min (Vsup) :
- 1.71V
- Number of Functions :
- 1
- Access Time :
- 8.4ns
- Height Seated (Max) :
- 1.4mm
- Memory Interface :
- Parallel
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Packaging :
- Tray
- Memory Size :
- 36Mb 2M x 18
- Operating Temperature :
- 0°C~70°C TA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- IS61QDB22M18C-250M3
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18C-250M3 Overview
Introducing the Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18C-250M3, a high-capacity 36Mbit SRAM designed to meet the rigorous demands of high-performance data storage systems. This IC features a parallel interface and is packaged in a compact 165-pin LFBGA, making it ideal for applications requiring high speed, reliability, and minimal footprint. With its advanced architecture, the Memory ISSI IS61QDB22M18C-250M3 ensures robust performance and exceptional data integrity, making it an excellent choice for manufacturers looking to enhance their product offerings with superior memory solutions.
IS61QDB22M18C-250M3 Features
The IS61QDB22M18C-250M3 offers several key features that make it a standout choice for integration in advanced electronic systems:
- 36Mbit high-density SRAM provides ample storage for demanding applications.
- Parallel interface ensures fast data access and throughput, optimizing system performance.
- Compact 165LFBGA package allows for efficient use of board space, ideal for space-constrained applications.
- High reliability and stability under a wide range of environmental conditions.
IS61QDB22M18C-250M3 Applications
- Networking Equipment: Utilized in routers and switches to manage fast data buffer requirements, enhancing network performance and efficiency.
- Telecommunications Systems: Critical in telecommunication infrastructure, facilitating rapid access to buffer memory which is essential for high-speed data processing and real-time communication.
- Automotive Electronics: Supports advanced driver-assistance systems (ADAS) by providing high-speed, reliable data caching necessary for real-time sensor data processing.
- Industrial Automation: Ideal for use in control systems where fast and reliable data access is critical for process management and equipment monitoring.
- Gaming Systems: Enhances gaming consoles' performance by providing quick access to graphics and AI data, thus improving user experience and system responsiveness.
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