IS61QDB22M18A-250M3L

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Mfr.Part #
IS61QDB22M18A-250M3L
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165LFBGA
Stock
34,370
In Stock :
34,370

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Organization :
2MX36
Standby Voltage-Min :
1.7V
Packaging :
Tray
I/O Type :
Separate
Terminal Position :
BOTTOM
Package / Case :
165-LBGA
Memory Width :
36
Pin Count :
165
Number of Functions :
1
Terminal Pitch :
1mm
RoHS Status :
ROHS3 Compliant
Supply Voltage :
1.8V
Voltage - Supply :
1.71V~1.89V
Memory Size :
36Mb 2M x 18
Supply Voltage-Min (Vsup) :
1.71V
Width :
15mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Standby Current-Max :
0.27A
Mounting Type :
Surface Mount
Height Seated (Max) :
1.4mm
Memory Interface :
Parallel
Operating Temperature :
0°C~70°C TA
Qualification Status :
Not Qualified
Access Time :
8.4ns
Supply Current-Max :
0.95mA
Additional Feature :
PIPELINED ARCHITECTURE
Memory Density :
75497472 bit
Number of Pins :
165
Length :
17mm
Power Supplies :
1.5/1.81.8V
Output Characteristics :
3-STATE
Supply Voltage-Max (Vsup) :
1.89V
Memory Format :
SRAM
Number of Terminations :
165
Memory Type :
Volatile
Clock Frequency :
250MHz
HTS Code :
8542.32.00.41
ECCN Code :
3A991.B.2.A
Surface Mount :
yes
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18A-250M3L from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-LBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Number of Pins:165, Number of Terminations:165, IS61QDB22M18A-250M3L pinout, IS61QDB22M18A-250M3L datasheet PDF, IS61QDB22M18A-250M3L amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18A-250M3L ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18A-250M3L


Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18A-250M3L Overview

The Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18A-250M3L is a high-performance 36Mbit SRAM module, engineered to meet the demanding requirements of advanced computing and high-speed data processing systems. This SRAM module is packaged in a compact 165LFBGA (Ball Grid Array) form factor, making it ideal for applications where space is at a premium and high data integrity is essential. With its parallel interface, this memory module offers high-speed data access and seamless integration with a wide range of industrial and commercial devices, providing a reliable solution for storing and managing critical data.

IS61QDB22M18A-250M3L Features

This 36Mbit SRAM from ISSI is designed for fast and reliable performance. The device features a parallel interface for rapid data transfer and a dense 165LFBGA package that minimizes PCB space usage. Additionally, its robust design ensures stable operation under extended industrial temperature ranges, making it suitable for a variety of challenging environments.

IS61QDB22M18A-250M3L Applications

  • Networking Equipment: Utilized in routers and switches for packet buffering and data queuing, enhancing network efficiency and speed.
  • Telecommunications: Deployed in telecom infrastructure to manage fast access to data tables and buffering needs, critical for real-time communication systems.
  • Industrial Automation: Integral in PLCs and industrial PCs for process control applications, where quick data retrieval is necessary for system responsiveness and reliability.
  • Aerospace and Defense: Used in avionics and military systems for high-speed data logging and real-time system monitoring, where data integrity and speed are paramount.
  • Medical Devices: Supports critical medical imaging systems like MRI and CT scanners, providing the necessary speed for image processing and data management.
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