IS61QDB22M18-250M3L

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Mfr.Part #
IS61QDB22M18-250M3L
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165LFBGA
Stock
9,579
In Stock :
9,579

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Number of Ports :
2
Memory Size :
36Mb 2M x 18
Radiation Hardening :
No
Mounting Type :
Surface Mount
Supply Voltage :
1.8V
Memory Interface :
Parallel
Number of Terminations :
165
Word Size :
18b
Operating Supply Voltage :
1.8V
Pbfree Code :
yes
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
I/O Type :
Separate
Additional Feature :
PIPELINED ARCHITECTURE
Sync/Async :
SYNCHRONOUS
Supply Voltage-Min (Vsup) :
1.71V
Time@Peak Reflow Temperature-Max (s) :
40
Output Characteristics :
3-STATE
Density :
36 Mb
Supply Voltage-Max (Vsup) :
1.89V
RoHS Status :
Non-RoHS Compliant
Terminal Position :
BOTTOM
Number of Pins :
165
Pin Count :
165
Memory Format :
SRAM
Peak Reflow Temperature (Cel) :
260
Package / Case :
165-LBGA
Number of Functions :
1
Nominal Supply Current :
700mA
JESD-609 Code :
e1
Standby Voltage-Min :
1.71V
Operating Temperature :
0°C~70°C TA
Memory Type :
Volatile
Length :
17mm
Clock Frequency :
250MHz
Access Time :
7.5ns
Address Bus Width :
20b
Height Seated (Max) :
1.7mm
Terminal Pitch :
1mm
Voltage - Supply :
1.71V~1.89V
Moisture Sensitivity Level (MSL) :
2 (1 Year)
Memory Width :
18
Packaging :
Tray
Mount :
Surface Mount
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18-250M3L from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:165, Number of Pins:165, Package / Case:165-LBGA, Operating Temperature:0°C~70°C TA, IS61QDB22M18-250M3L pinout, IS61QDB22M18-250M3L datasheet PDF, IS61QDB22M18-250M3L amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18-250M3L ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18-250M3L


Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18-250M3L Overview

The Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18-250M3L is a high-performance 36Mbit SRAM device, ideal for applications requiring fast access and storage of data. This memory chip is housed in a compact 165LFBGA package, ensuring high-density integration while maintaining a small form factor. Its parallel interface ensures simplified integration with a wide range of advanced microprocessors and digital signal processors. Designed for high-speed operation at 250 MHz, it caters to systems demanding swift and reliable data retrieval and storage, making it a robust choice for sophisticated electronic systems.

IS61QDB22M18-250M3L Features

This SRAM model boasts a storage capacity of 36Mbit, encapsulated in a 165-pin LFBGA package that offers durability and efficient space usage in circuit designs. Its compatibility with a parallel interface allows for rapid data access speeds, vital for high-performance computing environments. Operating at a clock frequency of 250 MHz, it supports extensive data operations with minimal latency, thereby enhancing the overall system responsiveness.

IS61QDB22M18-250M3L Applications

  • Advanced Computing Systems: Utilized in servers and high-performance computers, this SRAM can manage extensive data loads with ease, facilitating fast data processing and storage.
  • Networking Equipment: Key to routers and switches, the IS61QDB22M18-250M3L enhances data throughput and storage in complex network infrastructures, improving system reliability and performance.
  • Automotive Applications: Ideal for use in advanced driver-assistance systems (ADAS) where quick data access is crucial for real-time decision making and performance.
  • Industrial Automation: Plays a pivotal role in PLCs and other automation systems, where speed and data integrity are essential for controlling manufacturing processes efficiently.
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