IS61QDB22M18-250M3

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Mfr.Part #
IS61QDB22M18-250M3
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165LFBGA
Stock
44,535
In Stock :
44,535

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Operating Supply Voltage :
1.8V
RoHS Status :
Non-RoHS Compliant
JESD-609 Code :
e1
Voltage - Supply :
1.71V~1.89V
Supply Voltage-Min (Vsup) :
1.71V
Radiation Hardening :
No
Time@Peak Reflow Temperature-Max (s) :
40
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Pbfree Code :
yes
Memory Width :
18
Terminal Position :
BOTTOM
Mounting Type :
Surface Mount
I/O Type :
Separate
Number of Pins :
165
Nominal Supply Current :
700mA
Memory Format :
SRAM
Packaging :
Tray
Clock Frequency :
250MHz
Memory Type :
Volatile
Memory Size :
36Mb 2M x 18
Mount :
Surface Mount
Peak Reflow Temperature (Cel) :
260
Word Size :
18b
Length :
17mm
Address Bus Width :
20b
Sync/Async :
SYNCHRONOUS
Pin Count :
165
Operating Temperature :
0°C~70°C TA
Output Characteristics :
3-STATE
Access Time :
7.5ns
Package / Case :
165-LBGA
Terminal Pitch :
1mm
Additional Feature :
PIPELINED ARCHITECTURE
Memory Interface :
Parallel
Density :
36 Mb
Standby Voltage-Min :
1.71V
Number of Functions :
1
Moisture Sensitivity Level (MSL) :
2 (1 Year)
Number of Ports :
2
Supply Voltage :
1.8V
Number of Terminations :
165
Height Seated (Max) :
1.7mm
Supply Voltage-Max (Vsup) :
1.89V
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18-250M3 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Pins:165, Operating Temperature:0°C~70°C TA, Package / Case:165-LBGA, Number of Terminations:165, IS61QDB22M18-250M3 pinout, IS61QDB22M18-250M3 datasheet PDF, IS61QDB22M18-250M3 amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18-250M3 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18-250M3


Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18-250M3 Overview

The Memory Integrated Silicon Solution, Inc. (ISSI) IS61QDB22M18-250M3 is a high-performance IC SRAM component designed for demanding applications that require rapid access to large volumes of data. With a substantial 36Mbit capacity and a parallel interface, this SRAM module is housed in a compact 165LFBGA package, making it an ideal solution for space-sensitive applications without compromising on power or speed. The product is engineered by ISSI, a leader in advanced integrated circuit solutions, ensuring reliability and high-end performance.

IS61QDB22M18-250M3 Features

This SRAM component boasts several key features, including its 36Mbit data storage capacity, a parallel interface for rapid data access, and a robust 165LFBGA package that ensures durability and consistent performance under a wide range of environmental conditions. Its high-speed operation and reliability make it suitable for intensive data-processing tasks.

IS61QDB22M18-250M3 Applications

  • Networking Equipment: Utilized in routers and switches for buffering data, ensuring smooth data flow and minimizing packet loss in high-traffic environments.
  • Telecommunications: Critical for use in telecom infrastructure, facilitating fast access and processing of information to maintain system integrity and communication reliability.
  • Industrial Automation: Supports real-time processing and control in industrial environments, where speed and data integrity are crucial for operational efficiency and safety.
  • Automotive: Enhances performance in automotive applications, particularly in advanced driver-assistance systems (ADAS) where rapid data processing is essential for real-time decision-making.
  • Medical Devices: Used in medical equipment for high-speed data handling to ensure accurate and efficient patient monitoring and diagnostics.
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