IS61NVP51236-250B3

Manufacturer :

Integrated Silicon Solution, Inc. (ISSI)

Product Category :

Memory

Package / Case :

165-TBGA

Memory Size :

18Mb 512K x 36

Supply Current-Max :

0.45mA

Power Supplies :

2.5V

Terminal Pitch :

1mm

Clock Frequency :

250MHz

Mounting Type :

Surface Mount

Supply Voltage-Min (Vsup) :

2.375V

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Supply Voltage :

2.5V

JESD-609 Code :

e0

Width :

13mm

Voltage - Supply :

2.375V~2.625V

Pbfree Code :

No

Memory Interface :

Parallel

I/O Type :

COMMON

Additional Feature :

PIPELINED ARCHITECTURE

Length :

15mm

Organization :

512KX36

ECCN Code :

3A991.B.2.A

Pin Count :

165

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RoHS Status :

ROHS3 Compliant

Access Time :

2.6ns

Supply Voltage-Max (Vsup) :

2.625V

Terminal Position :

BOTTOM

Operating Temperature :

0°C~70°C TA

Standby Voltage-Min :

2.38V

Packaging :

Tray

Height Seated (Max) :

1.2mm

Number of Terminations :

165

Memory Width :

36

Memory Density :

18874368 bit

JESD-30 Code :

R-PBGA-B165

Surface Mount :

yes

Output Characteristics :

3-STATE

Memory Type :

Volatile

HTS Code :

8542.32.00.41

Standby Current-Max :

0.06A

Number of Functions :

1

Memory Format :

SRAM

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Qualification Status :

Not Qualified

Terminal Finish :

Tin/Lead (Sn/Pb)