IS61NVP51236-200B3
- Mfr.Part #
- IS61NVP51236-200B3
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 5,154
- In Stock :
- 5,154
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Memory Format :
- SRAM
- Memory Type :
- Volatile
- Memory Width :
- 36
- Qualification Status :
- Not Qualified
- Width :
- 13mm
- Pin Count :
- 165
- Memory Density :
- 18874368 bit
- Mounting Type :
- Surface Mount
- Additional Feature :
- PIPELINED ARCHITECTURE
- I/O Type :
- COMMON
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Terminal Position :
- BOTTOM
- Pbfree Code :
- No
- Number of Functions :
- 1
- RoHS Status :
- ROHS3 Compliant
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Surface Mount :
- yes
- Standby Current-Max :
- 0.06A
- Memory Size :
- 18Mb 512K x 36
- Clock Frequency :
- 200MHz
- Packaging :
- Tray
- Memory Interface :
- Parallel
- Length :
- 15mm
- JESD-609 Code :
- e0
- Voltage - Supply :
- 2.375V~2.625V
- Package / Case :
- 165-TBGA
- HTS Code :
- 8542.32.00.41
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Supply Voltage-Min (Vsup) :
- 2.375V
- Number of Terminations :
- 165
- Supply Voltage-Max (Vsup) :
- 2.625V
- Organization :
- 512KX36
- JESD-30 Code :
- R-PBGA-B165
- Supply Current-Max :
- 0.425mA
- Supply Voltage :
- 2.5V
- Terminal Pitch :
- 1mm
- Power Supplies :
- 2.5V
- ECCN Code :
- 3A991.B.2.A
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Height Seated (Max) :
- 1.2mm
- Access Time :
- 3.1ns
- Output Characteristics :
- 3-STATE
- Standby Voltage-Min :
- 2.38V
- Operating Temperature :
- 0°C~70°C TA
- Datasheets
- IS61NVP51236-200B3
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVP51236-200B3 Overview
The Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVP51236-200B3 is a high-performance 18Mbit SRAM chip, offering robust parallel interfaces encapsulated in a compact 165TFBGA package. Designed for high-speed operations and optimized for reliability, this memory module is ideal for applications requiring quick access and storage of large amounts of data. Its superior architecture ensures enhanced system stability and improved data integrity, making it a top choice for sophisticated electronic systems seeking efficient and rapid memory solutions.
IS61NVP51236-200B3 Features
- 18Mbit high-density SRAM: Provides ample space for quick data retrieval and storage.
- Parallel interface: Facilitates higher throughput and faster data access speeds.
- 165TFBGA package: Ensures a reduced footprint on system boards, allowing for more compact device designs.
- Stable performance under varying conditions: Reliable data integrity and system robustness.
IS61NVP51236-200B3 Applications
- Networking equipment: Utilized in routers and switches for buffer and cache functions, enhancing data flow efficiency.
- Telecommunication systems: Helps in data storage for fast retrieval and processing in communication infrastructure.
- Automotive electronics: Used in advanced driver-assistance systems (ADAS) for rapid data processing and storage.
- Industrial automation: Facilitates complex computations and real-time data handling in control systems.
- Medical devices: Essential for data-intensive applications such as imaging systems, where quick access to large data sets is crucial.
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