IS61NVP51236-200B3

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Mfr.Part #
IS61NVP51236-200B3
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165TFBGA
Stock
5,154
In Stock :
5,154

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Memory Format :
SRAM
Memory Type :
Volatile
Memory Width :
36
Qualification Status :
Not Qualified
Width :
13mm
Pin Count :
165
Memory Density :
18874368 bit
Mounting Type :
Surface Mount
Additional Feature :
PIPELINED ARCHITECTURE
I/O Type :
COMMON
Terminal Finish :
Tin/Lead (Sn/Pb)
Terminal Position :
BOTTOM
Pbfree Code :
No
Number of Functions :
1
RoHS Status :
ROHS3 Compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Surface Mount :
yes
Standby Current-Max :
0.06A
Memory Size :
18Mb 512K x 36
Clock Frequency :
200MHz
Packaging :
Tray
Memory Interface :
Parallel
Length :
15mm
JESD-609 Code :
e0
Voltage - Supply :
2.375V~2.625V
Package / Case :
165-TBGA
HTS Code :
8542.32.00.41
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Supply Voltage-Min (Vsup) :
2.375V
Number of Terminations :
165
Supply Voltage-Max (Vsup) :
2.625V
Organization :
512KX36
JESD-30 Code :
R-PBGA-B165
Supply Current-Max :
0.425mA
Supply Voltage :
2.5V
Terminal Pitch :
1mm
Power Supplies :
2.5V
ECCN Code :
3A991.B.2.A
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Height Seated (Max) :
1.2mm
Access Time :
3.1ns
Output Characteristics :
3-STATE
Standby Voltage-Min :
2.38V
Operating Temperature :
0°C~70°C TA
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVP51236-200B3 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:165-TBGA, Number of Terminations:165, Operating Temperature:0°C~70°C TA, IS61NVP51236-200B3 pinout, IS61NVP51236-200B3 datasheet PDF, IS61NVP51236-200B3 amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVP51236-200B3 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61NVP51236-200B3


Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVP51236-200B3 Overview

The Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVP51236-200B3 is a high-performance 18Mbit SRAM chip, offering robust parallel interfaces encapsulated in a compact 165TFBGA package. Designed for high-speed operations and optimized for reliability, this memory module is ideal for applications requiring quick access and storage of large amounts of data. Its superior architecture ensures enhanced system stability and improved data integrity, making it a top choice for sophisticated electronic systems seeking efficient and rapid memory solutions.

IS61NVP51236-200B3 Features

  • 18Mbit high-density SRAM: Provides ample space for quick data retrieval and storage.
  • Parallel interface: Facilitates higher throughput and faster data access speeds.
  • 165TFBGA package: Ensures a reduced footprint on system boards, allowing for more compact device designs.
  • Stable performance under varying conditions: Reliable data integrity and system robustness.

IS61NVP51236-200B3 Applications

  • Networking equipment: Utilized in routers and switches for buffer and cache functions, enhancing data flow efficiency.
  • Telecommunication systems: Helps in data storage for fast retrieval and processing in communication infrastructure.
  • Automotive electronics: Used in advanced driver-assistance systems (ADAS) for rapid data processing and storage.
  • Industrial automation: Facilitates complex computations and real-time data handling in control systems.
  • Medical devices: Essential for data-intensive applications such as imaging systems, where quick access to large data sets is crucial.
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