IS61NVP102418-250B3I

Manufacturer :

Integrated Silicon Solution, Inc. (ISSI)

Product Category :

Memory

Pbfree Code :

No

RoHS Status :

ROHS3 Compliant

JESD-609 Code :

e0

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Supply Voltage-Max (Vsup) :

2.625V

Additional Feature :

PIPELINED ARCHITECTURE

Supply Voltage :

2.5V

Number of Functions :

1

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Memory Format :

SRAM

Qualification Status :

Not Qualified

Standby Voltage-Min :

2.38V

Package / Case :

165-TBGA

ECCN Code :

3A991.B.2.A

I/O Type :

COMMON

Packaging :

Tray

Access Time :

2.6ns

Memory Size :

18Mb 1M x 18

Pin Count :

165

Standby Current-Max :

0.075A

Supply Current-Max :

0.5mA

Power Supplies :

2.5V

Terminal Position :

BOTTOM

Memory Density :

18874368 bit

Voltage - Supply :

2.375V~2.625V

Output Characteristics :

3-STATE

Clock Frequency :

250MHz

HTS Code :

8542.32.00.41

Number of Terminations :

165

Width :

13mm

Memory Type :

Volatile

Number of Pins :

165

Operating Temperature :

-40°C~85°C TA

Terminal Finish :

Tin/Lead (Sn/Pb)

Organization :

1MX18

Supply Voltage-Min (Vsup) :

2.375V

Mounting Type :

Surface Mount

Memory Interface :

Parallel

Height Seated (Max) :

1.2mm

Memory Width :

18

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Length :

15mm

Terminal Pitch :

1mm

Surface Mount :

yes