IS61NVP102418-200B3I

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Mfr.Part #
IS61NVP102418-200B3I
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165TFBGA
Stock
48,737
In Stock :
48,737

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Power Supplies :
2.5V
Terminal Position :
BOTTOM
Standby Voltage-Min :
2.38V
Pin Count :
165
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Voltage - Supply :
2.375V~2.625V
Surface Mount :
yes
Mounting Type :
Surface Mount
Supply Voltage-Max (Vsup) :
2.625V
Output Characteristics :
3-STATE
Access Time :
3.1ns
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Supply Voltage-Min (Vsup) :
2.375V
Number of Terminations :
165
Memory Interface :
Parallel
Memory Size :
18Mb 1M x 18
HTS Code :
8542.32.00.41
Additional Feature :
PIPELINED ARCHITECTURE
Terminal Pitch :
1mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Pbfree Code :
No
Qualification Status :
Not Qualified
JESD-609 Code :
e0
Width :
13mm
Supply Current-Max :
0.475mA
Number of Functions :
1
RoHS Status :
ROHS3 Compliant
Supply Voltage :
2.5V
Memory Width :
18
Memory Format :
SRAM
Organization :
1MX18
Clock Frequency :
200MHz
Packaging :
Tray
Terminal Finish :
Tin/Lead (Sn/Pb)
Operating Temperature :
-40°C~85°C TA
ECCN Code :
3A991.B.2.A
Memory Type :
Volatile
I/O Type :
COMMON
Package / Case :
165-TBGA
Number of Pins :
165
Standby Current-Max :
0.075A
Length :
15mm
Height Seated (Max) :
1.2mm
Memory Density :
18874368 bit
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVP102418-200B3I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:165, Operating Temperature:-40°C~85°C TA, Package / Case:165-TBGA, Number of Pins:165, IS61NVP102418-200B3I pinout, IS61NVP102418-200B3I datasheet PDF, IS61NVP102418-200B3I amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVP102418-200B3I ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61NVP102418-200B3I


Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVP102418-200B3I Overview

The IS61NVP102418-200B3I by Integrated Silicon Solution, Inc. (ISSI) is a high-performance 18Mbit SRAM component, encapsulated in a compact 165TFBGA package. This memory module offers a robust parallel interface, ensuring high-speed data access and reliability for advanced applications. Designed to meet the stringent demands of high-throughput systems, the IS61NVP102418-200B3I integrates seamlessly into various digital applications, making it a prime choice for businesses looking to enhance their technology infrastructure with Memory Integrated Silicon Solution, Inc. (ISSI) products.

IS61NVP102418-200B3I Features

The IS61NVP102418-200B3I SRAM features a dense 18Mbit capacity, providing ample space for high-speed operations. The parallel interface facilitates quick data transfer rates, which is crucial for systems requiring fast access to large volumes of data. The 165TFBGA package is not only space-efficient but also offers improved thermal characteristics, enhancing the overall durability and performance of the memory module under varied operating conditions.

IS61NVP102418-200B3I Applications

  • Networking Equipment: Utilized in routers and switches for buffer memory, where quick data retrieval is critical for efficient packet processing.
  • Telecommunications: Employed in telecom infrastructure to manage real-time data transactions, ensuring smooth and reliable communications.
  • Automotive Electronics: Integrated into automotive systems for advanced driver-assistance systems (ADAS), requiring fast memory access for real-time processing.
  • Industrial Automation: Used in control systems where rapid data access and high reliability are necessary for seamless production processes.
  • High-Performance Computing: Serves as temporary storage in computing clusters to speed up processing tasks and data analysis.
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