IS61NVF51236-6.5B3I
- Mfr.Part #
- IS61NVF51236-6.5B3I
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 1,687
- In Stock :
- 1,687
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Mounting Type :
- Surface Mount
- Additional Feature :
- FLOW-THROUGH ARCHITECTURE
- Pbfree Code :
- No
- Memory Format :
- SRAM
- Supply Voltage-Min (Vsup) :
- 2.375V
- Width :
- 13mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Operating Temperature :
- -40°C~85°C TA
- Standby Voltage-Min :
- 2.38V
- Voltage - Supply :
- 2.375V~2.625V
- I/O Type :
- COMMON
- Number of Terminations :
- 165
- Memory Type :
- Volatile
- HTS Code :
- 8542.32.00.41
- Package / Case :
- 165-TBGA
- Standby Current-Max :
- 0.075A
- Supply Voltage :
- 2.5V
- Number of Functions :
- 1
- Clock Frequency :
- 133MHz
- Access Time :
- 6.5ns
- Height Seated (Max) :
- 1.2mm
- Organization :
- 512KX36
- Supply Voltage-Max (Vsup) :
- 2.625V
- Pin Count :
- 165
- Length :
- 15mm
- Memory Density :
- 18874368 bit
- Qualification Status :
- Not Qualified
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Pitch :
- 1mm
- Memory Width :
- 36
- Supply Current-Max :
- 0.5mA
- Number of Pins :
- 165
- ECCN Code :
- 3A991.B.2.A
- Packaging :
- Tray
- Surface Mount :
- yes
- Terminal Position :
- BOTTOM
- RoHS Status :
- ROHS3 Compliant
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Output Characteristics :
- 3-STATE
- Memory Interface :
- Parallel
- Power Supplies :
- 2.5V
- JESD-609 Code :
- e0
- Memory Size :
- 18Mb 512K x 36
- Datasheets
- IS61NVF51236-6.5B3I
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVF51236-6.5B3I Overview
The IS61NVF51236-6.5B3I by Integrated Silicon Solution, Inc. (ISSI) is a high-performance 18Mbit SRAM, featuring a parallel interface for rapid data access and processing capabilities. This memory device is encapsulated in a compact 165TFBGA package, designed to ensure minimal footprint on the PCB while maximizing thermal efficiency and signal integrity. With its robust build and advanced technology, the Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVF51236-6.5B3I is tailored to meet the rigorous demands of sophisticated electronic systems, offering a reliable and efficient memory solution for B2B customers seeking high-volume procurement.
IS61NVF51236-6.5B3I Features
This SRAM component operates at a speed of 6.5ns, providing high-speed data retrieval and storage capabilities that are essential for real-time applications. Its parallel interface allows for quick and straightforward integration into existing architectures, minimizing development time and facilitating easier scaling of systems. The device's low-power consumption and high-density packaging make it an ideal choice for power-sensitive applications requiring compact yet powerful memory solutions.
IS61NVF51236-6.5B3I Applications
- Networking Equipment: Used in routers, switches, and other networking hardware to buffer data during high-speed data transfers and processing.
- Telecommunications Infrastructure: Employs this SRAM for handling complex algorithms and processing in telecommunications systems.
- Automotive Systems: Integral for advanced driver-assistance systems (ADAS) where rapid data access is crucial for real-time decision making.
- Industrial Automation: Facilitates high-speed, reliable data management in automation controllers and real-time industrial systems.
- Medical Devices: Supports the functionality of medical imaging systems where large amounts of data need to be accessed quickly and reliably.
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