IS61NVF102418-6.5B3
- Mfr.Part #
- IS61NVF102418-6.5B3
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 24,643
- In Stock :
- 24,643
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage-Max (Vsup) :
- 2.625V
- Voltage - Supply :
- 2.375V~2.625V
- Number of Functions :
- 1
- Number of Terminations :
- 165
- Power Supplies :
- 2.5V
- Memory Format :
- SRAM
- Qualification Status :
- Not Qualified
- Memory Density :
- 18874368 bit
- Additional Feature :
- FLOW-THROUGH ARCHITECTURE
- Memory Interface :
- Parallel
- Standby Voltage-Min :
- 2.38V
- Output Characteristics :
- 3-STATE
- Terminal Pitch :
- 1mm
- Access Time :
- 6.5ns
- Supply Current-Max :
- 0.45mA
- Memory Size :
- 18Mb 1M x 18
- Memory Type :
- Volatile
- Surface Mount :
- yes
- Organization :
- 1MX18
- Pbfree Code :
- No
- Clock Frequency :
- 133MHz
- Operating Temperature :
- 0°C~70°C TA
- JESD-609 Code :
- e0
- HTS Code :
- 8542.32.00.41
- Terminal Position :
- BOTTOM
- Supply Voltage-Min (Vsup) :
- 2.375V
- Memory Width :
- 18
- Width :
- 13mm
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- RoHS Status :
- ROHS3 Compliant
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Standby Current-Max :
- 0.06A
- Length :
- 15mm
- I/O Type :
- COMMON
- Supply Voltage :
- 2.5V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Packaging :
- Tray
- Height Seated (Max) :
- 1.2mm
- Pin Count :
- 165
- Package / Case :
- 165-TBGA
- Number of Pins :
- 165
- Mounting Type :
- Surface Mount
- ECCN Code :
- 3A991.B.2.A
- Datasheets
- IS61NVF102418-6.5B3
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVF102418-6.5B3 Overview
The IS61NVF102418-6.5B3 from Integrated Silicon Solution, Inc. (ISSI) is a cutting-edge SRAM chip designed for high-speed and reliable performance in demanding applications. With a substantial 18Mbit storage capacity and a parallel interface, this SRAM chip is housed in a compact 165TFBGA package, ensuring efficient space usage and enhanced thermal management. The Memory Integrated Silicon Solution, Inc. (ISSI) IS61NVF102418-6.5B3 is tailored for systems requiring rapid access to large amounts of temporary data, ideal for enhancing system responsiveness and processing capabilities in advanced computing environments.
IS61NVF102418-6.5B3 Features
This SRAM component offers a robust set of features suited for high-performance computing tasks. Key attributes include a parallel interface for swift data transfer, a 6.5 ns clock speed for rapid access rates, and a dense 18Mbit capacity for extensive data storage without compromising the physical footprint. The 165TFBGA package is not only space-efficient but also optimizes reliability and durability in rigorous operational conditions.
IS61NVF102418-6.5B3 Applications
- Networking Equipment: Utilized in routers and switches for buffering data, ensuring efficient packet transmission and reception in network infrastructures.
- High-performance Computing: Employed in servers and workstations to facilitate fast data access and processing, enhancing overall system throughput and responsiveness.
- Telecommunications: Integral in telecommunications hardware where quick data retrieval is crucial for real-time signal processing and communication exchanges.
- Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to manage and process large volumes of sensor data swiftly, aiding in real-time decision making and vehicle control.
- Industrial Automation: Applied in PLCs and other control systems for fast data handling, supporting reliable and efficient automated operations.
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