IS61NLP51236-250B3I

Manufacturer :

Integrated Silicon Solution, Inc. (ISSI)

Product Category :

Memory

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Memory Size :

18Mb 512K x 36

Terminal Position :

BOTTOM

Additional Feature :

PIPELINED ARCHITECTURE

Supply Voltage-Min (Vsup) :

3.135V

Package / Case :

165-TBGA

Terminal Finish :

Tin/Lead (Sn/Pb)

Number of Terminations :

165

Standby Current-Max :

0.075A

RoHS Status :

ROHS3 Compliant

Pbfree Code :

No

Voltage - Supply :

3.135V~3.465V

Pin Count :

165

Qualification Status :

Not Qualified

Memory Type :

Volatile

Mounting Type :

Surface Mount

Operating Temperature :

-40°C~85°C TA

I/O Type :

COMMON

Terminal Pitch :

1mm

Memory Interface :

Parallel

Packaging :

Tray

Number of Functions :

1

HTS Code :

8542.32.00.41

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Supply Current-Max :

0.5mA

Height Seated (Max) :

1.2mm

Supply Voltage-Max (Vsup) :

3.465V

JESD-30 Code :

R-PBGA-B165

Memory Width :

36

Length :

15mm

Organization :

512KX36

Power Supplies :

2.5/3.33.3V

Clock Frequency :

250MHz

Access Time :

2.6ns

Surface Mount :

yes

ECCN Code :

3A991.B.2.A

Supply Voltage :

3.3V

Memory Density :

18874368 bit

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Width :

13mm

Memory Format :

SRAM

Standby Voltage-Min :

3.14V

Output Characteristics :

3-STATE

JESD-609 Code :

e0