IS61NLP51236-200B3I

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Mfr.Part #
IS61NLP51236-200B3I
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165TFBGA
Stock
3,877
In Stock :
3,877

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Memory Type :
Volatile
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tape and Reel (TR)
Clock Frequency :
200MHz
Access Time :
3.1ns
Mounting Type :
Surface Mount
Voltage - Supply :
3.135V~3.465V
Operating Temperature :
-40°C~85°C TA
Package / Case :
165-TBGA
RoHS Status :
ROHS3 Compliant
Memory Format :
SRAM
Memory Size :
18Mb 512K x 36
Memory Interface :
Parallel
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLP51236-200B3I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, Package / Case:165-TBGA, IS61NLP51236-200B3I pinout, IS61NLP51236-200B3I datasheet PDF, IS61NLP51236-200B3I amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLP51236-200B3I ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61NLP51236-200B3I


Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLP51236-200B3I Overview

Discover the cutting-edge IC SRAM 18MBIT PARALLEL 165TFBGA from Integrated Silicon Solution, Inc. (ISSI). Crafted with precision and innovation, this memory module redefines performance and reliability in the realm of integrated circuits. With a capacity of 18 megabits and utilizing parallel architecture, it offers lightning-fast data access and seamless integration into diverse systems. Whether powering industrial machinery or driving high-performance computing, this IC empowers your applications with unparalleled speed and efficiency.

IS61NLP51236-200B3I Features

  • High Capacity: Boasting an impressive 18 megabit capacity, this IC ensures ample storage for your data-intensive applications.
  • Parallel Architecture: Leveraging parallel processing, it delivers rapid data access, enabling swift execution of commands and tasks.
  • Compact Design: Housed in a 165TFBGA package, this memory module offers space-efficient integration into various electronic devices and systems.
  • Reliability: Engineered with the renowned quality of Integrated Silicon Solution, Inc. (ISSI), it guarantees long-term stability and consistent performance.
  • Low Power Consumption: Despite its high performance, this IC maintains energy efficiency, prolonging battery life and reducing operational costs.

IS61NLP51236-200B3I Applications

  • Industrial Automation: Implement this memory module in industrial control systems to store critical operational data and ensure seamless machinery operation.
  • Telecommunications Infrastructure: Enhance the performance of telecom equipment by integrating this IC for fast data processing and transmission.
  • Medical Devices: Power medical instruments and diagnostic equipment with this high-capacity memory, facilitating quick access to patient records and diagnostic algorithms.
  • Automotive Electronics: Enable advanced features in vehicles, such as infotainment systems and driver assistance technologies, with the reliable performance of this memory module.
  • Networking Hardware: Equip routers, switches, and other networking devices with this IC to support high-speed data routing and packet switching.
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Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

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