IS61NLP25636A-200B2I

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Mfr.Part #
IS61NLP25636A-200B2I
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
119-BBGA
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 119PBGA
Stock
11,109
In Stock :
11,109

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Pin Count :
119
Qualification Status :
Not Qualified
Packaging :
Tray
Surface Mount :
yes
Supply Voltage-Min (Vsup) :
3.135V
Additional Feature :
PIPELINED ARCHITECTURE
Standby Current-Max :
0.05A
Terminal Pitch :
1.27mm
Package / Case :
119-BBGA
Pbfree Code :
No
Memory Size :
9Mb 256K x 36
I/O Type :
COMMON
Supply Current-Max :
0.28mA
Mounting Type :
Surface Mount
Number of Pins :
119
Width :
14mm
ECCN Code :
3A991.B.2.A
Access Time :
3.1ns
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Operating Temperature :
-40°C~85°C TA
Memory Format :
SRAM
HTS Code :
8542.32.00.41
Length :
22mm
RoHS Status :
Non-RoHS Compliant
Memory Type :
Volatile
Number of Functions :
1
Clock Frequency :
200MHz
Output Characteristics :
3-STATE
Voltage - Supply :
3.135V~3.465V
Terminal Position :
BOTTOM
Height Seated (Max) :
2.41mm
Supply Voltage-Max (Vsup) :
3.465V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of Terminations :
119
JESD-609 Code :
e0
Supply Voltage :
3.3V
Power Supplies :
2.5/3.33.3V
Memory Interface :
Parallel
Memory Width :
36
Terminal Finish :
Tin/Lead (Sn/Pb)
Memory Density :
9437184 bit
Standby Voltage-Min :
3.14V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Organization :
256KX36
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLP25636A-200B2I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:119-BBGA, Mounting Type:Surface Mount, Number of Pins:119, Operating Temperature:-40°C~85°C TA, Number of Terminations:119, IS61NLP25636A-200B2I pinout, IS61NLP25636A-200B2I datasheet PDF, IS61NLP25636A-200B2I amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLP25636A-200B2I ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61NLP25636A-200B2I


Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLP25636A-200B2I Overview

The IS61NLP25636A-200B2I, a high-performance SRAM component from Integrated Silicon Solution, Inc. (ISSI), is engineered to meet the demanding requirements of advanced computing and high-speed processing systems. This 9Mbit SRAM chip offers a robust parallel interface and is packaged in a compact 119-pin PBGA (Plastic Ball Grid Array), ensuring efficient space utilization and enhanced thermal management. The product stands out for its quick access times and reliability, making it an essential component in a broad range of applications, especially where speed and stability are critical. With the keyword Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLP25636A-200B2I, this SRAM ensures optimal performance in rigorous environments.

IS61NLP25636A-200B2I Features

The IS61NLP25636A-200B2I SRAM features include a dense 9Mbit storage capacity, a swift parallel interface for rapid data access and processing, and low power consumption, which is critical for sustainable product design. The use of the 119PBGA package facilitates not only reduced physical space requirements but also significant improvements in reliability and heat dissipation, features that are paramount when designing for durability and extended operational life.

IS61NLP25636A-200B2I Applications

  • Networking Equipment: Utilized in routers and switches for buffering and data queuing, ensuring efficient data management and high-speed data processing capabilities.
  • Telecommunications: Critical for use in telecommunications infrastructure, providing the necessary speed and reliability for managing vast amounts of data and high-level signal processing.
  • Industrial Automation: Employs in control systems where fast access to data and error-free operations are required, enhancing system reliability and performance.
  • Aerospace and Defense: Used in systems requiring high-reliability memory solutions that can perform under extreme environmental conditions, aiding in navigation and other critical systems.
  • Consumer Electronics: Integral to devices such as high-definition televisions and gaming consoles, where rapid access to large volumes of data is essential for user experience and functionality.
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