IS61NLP25618A-200B3I

Manufacturer :

Integrated Silicon Solution, Inc. (ISSI)

Product Category :

Memory

Surface Mount :

yes

Number of Functions :

1

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Organization :

256KX18

HTS Code :

8542.32.00.41

Number of Pins :

165

Supply Voltage-Max (Vsup) :

3.465V

Supply Current-Max :

0.21mA

Length :

15mm

Height Seated (Max) :

1.2mm

Supply Voltage :

3.3V

Supply Voltage-Min (Vsup) :

3.135V

Additional Feature :

PIPELINED ARCHITECTURE

Pin Count :

165

Terminal Finish :

Tin/Lead (Sn/Pb)

Power Supplies :

2.5/3.33.3V

RoHS Status :

Non-RoHS Compliant

Memory Format :

SRAM

Qualification Status :

Not Qualified

Packaging :

Tray

Terminal Position :

BOTTOM

Moisture Sensitivity Level (MSL) :

2 (1 Year)

Memory Density :

4718592 bit

Package / Case :

165-TFBGA

I/O Type :

COMMON

Terminal Pitch :

1mm

Memory Size :

4.5Mb 256K x 18

JESD-609 Code :

e0

Number of Terminations :

165

Access Time :

3.1ns

Output Characteristics :

3-STATE

Memory Width :

18

Width :

13mm

Clock Frequency :

200MHz

Memory Interface :

Parallel

ECCN Code :

3A991.B.2.A

Standby Current-Max :

0.035A

Standby Voltage-Min :

3.14V

Pbfree Code :

No

Operating Temperature :

-40°C~85°C TA

Voltage - Supply :

3.135V~3.465V

Memory Type :

Volatile

Mounting Type :

Surface Mount