IS61NLP102418-200B3LI
- Mfr.Part #
- IS61NLP102418-200B3LI
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 40,489
- In Stock :
- 40,489
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Time@Peak Reflow Temperature-Max (s) :
- 10
- Supply Voltage-Min (Vsup) :
- 3.135V
- Number of Functions :
- 1
- Memory Format :
- SRAM
- Terminal Position :
- BOTTOM
- JESD-609 Code :
- e1
- Terminal Pitch :
- 1mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- I/O Type :
- COMMON
- Number of Pins :
- 165
- Voltage - Supply :
- 3.135V~3.465V
- Clock Frequency :
- 200MHz
- Supply Voltage :
- 3.3V
- Operating Supply Voltage :
- 3.3V
- Length :
- 15mm
- Density :
- 18 Mb
- Number of Terminations :
- 165
- Address Bus Width :
- 20b
- Peak Reflow Temperature (Cel) :
- 260
- Access Time :
- 3.1ns
- Number of Ports :
- 2
- Packaging :
- Tray
- Standby Current-Max :
- 0.075A
- Pbfree Code :
- yes
- Package / Case :
- 165-TBGA
- Standby Voltage-Min :
- 3.14V
- Mounting Type :
- Surface Mount
- Memory Width :
- 18
- Sync/Async :
- SYNCHRONOUS
- Additional Feature :
- PIPELINED ARCHITECTURE
- Radiation Hardening :
- No
- Memory Interface :
- Parallel
- Organization :
- 1MX18
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Nominal Supply Current :
- 475mA
- RoHS Status :
- RoHS Compliant
- Surface Mount :
- yes
- Memory Size :
- 18Mb 1M x 18
- Output Characteristics :
- 3-STATE
- Word Size :
- 18b
- Pin Count :
- 165
- Operating Temperature :
- -40°C~85°C TA
- Supply Voltage-Max (Vsup) :
- 3.465V
- Memory Type :
- Volatile
- Datasheets
- IS61NLP102418-200B3LI
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLP102418-200B3LI Overview
The IS61NLP102418-200B3LI from Integrated Silicon Solution, Inc. (ISSI) is a high-performance 18Mbit SRAM IC, expertly designed for applications requiring fast and reliable storage solutions. This component utilizes a parallel interface for quick data transfer and is encapsulated in a compact 165TFBGA package that minimizes space while maximizing thermal and mechanical reliability. The Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLP102418-200B3LI is engineered to meet the rigorous demands of sophisticated electronic systems, offering both high density and ease of integration, making it an ideal choice for designers looking to enhance system performance with robust memory solutions.
IS61NLP102418-200B3LI Features
The IS61NLP102418-200B3LI features include a large 18Mbit capacity and a fast parallel interface that ensures quick access times, suitable for high-performance computing environments. Its 165TFBGA packaging is designed for efficient PCB layout, supporting tight integration in space-constrained applications. The device's operational stability is ensured across a wide range of temperatures, making it reliable in diverse operating conditions.
IS61NLP102418-200B3LI Applications
- Advanced Telecommunications: Employed in data buffering and high-speed caching to handle large volumes of data transfers.
- Networking Equipment: Utilized in routers and switches for packet buffering, ensuring smooth data flow and reduced latency in network communications.
- Automotive Electronics: Integrated into automotive infotainment systems, providing rapid access to media content and navigation data.
- Industrial Automation: Plays a crucial role in process control systems where rapid data retrieval is necessary for real-time operational decision making.
- Consumer Electronics: Applied in devices such as digital cameras and gaming consoles for fast game data and image processing capabilities.
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