IS61NLF51236-7.5B3I
- Mfr.Part #
- IS61NLF51236-7.5B3I
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 13,674
- In Stock :
- 13,674
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Memory Density :
- 18874368 bit
- Additional Feature :
- FLOW-THROUGH ARCHITECTURE
- ECCN Code :
- 3A991.B.2.A
- Pbfree Code :
- No
- Qualification Status :
- Not Qualified
- Memory Width :
- 36
- Width :
- 13mm
- Memory Type :
- Volatile
- Terminal Pitch :
- 1mm
- Clock Frequency :
- 117MHz
- Number of Pins :
- 165
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Memory Format :
- SRAM
- Height Seated (Max) :
- 1.2mm
- Mounting Type :
- Surface Mount
- Access Time :
- 7.5ns
- Standby Voltage-Min :
- 3.14V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Position :
- BOTTOM
- Supply Voltage-Min (Vsup) :
- 3.135V
- Supply Current-Max :
- 0.475mA
- I/O Type :
- COMMON
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Memory Size :
- 18Mb 512K x 36
- Number of Terminations :
- 165
- Organization :
- 512KX36
- Length :
- 15mm
- Pin Count :
- 165
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Voltage - Supply :
- 3.135V~3.465V
- Surface Mount :
- yes
- Package / Case :
- 165-TBGA
- HTS Code :
- 8542.32.00.41
- Supply Voltage-Max (Vsup) :
- 3.465V
- Memory Interface :
- Parallel
- JESD-609 Code :
- e0
- Output Characteristics :
- 3-STATE
- Operating Temperature :
- -40°C~85°C TA
- Number of Functions :
- 1
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Standby Current-Max :
- 0.075A
- Power Supplies :
- 2.5/3.33.3V
- Supply Voltage :
- 3.3V
- Datasheets
- IS61NLF51236-7.5B3I
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLF51236-7.5B3I Overview
The IS61NLF51236-7.5B3I, a high-performance SRAM from Integrated Silicon Solution, Inc. (ISSI), offers a substantial 18Mbit storage capacity in a densely packed 165TFBGA package. Designed for demanding applications requiring rapid access to large volumes of data, this IC features a parallel interface ensuring fast data transfer speeds while maintaining low power consumption. Ideal for B2B customers looking to implement advanced memory solutions in commercial and industrial applications, the Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLF51236-7.5B3I is engineered for reliability and high-speed operation.
IS61NLF51236-7.5B3I Features
This 18Mbit SRAM chip operates at 7.5ns access time, providing quick read and write capabilities essential for high-performance computing environments. The 165TFBGA package not only minimizes the footprint on circuit boards but also enhances thermal management and reduces electromagnetic interference, crucial for stable operations.
IS61NLF51236-7.5B3I Applications
- Networking Equipment: Utilized in routers and switches to manage data flow efficiently and enhance buffer memory.
- High-Performance Computing: Provides the necessary speed and capacity for temporary data storage in supercomputers and server farms.
- Telecommunications: Acts as a reliable storage solution in telecommunications infrastructure, supporting high-speed data transmission and processing.
- Aerospace and Defense: Meets the rigorous memory requirements for navigation and control systems in aerospace and defense applications.
- Industrial Automation: Integral in complex industrial machines for process control, where quick access to data is crucial for operational efficiency.
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