IS61NLF51236-7.5B3I

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Mfr.Part #
IS61NLF51236-7.5B3I
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165TFBGA
Stock
13,674
In Stock :
13,674

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Memory Density :
18874368 bit
Additional Feature :
FLOW-THROUGH ARCHITECTURE
ECCN Code :
3A991.B.2.A
Pbfree Code :
No
Qualification Status :
Not Qualified
Memory Width :
36
Width :
13mm
Memory Type :
Volatile
Terminal Pitch :
1mm
Clock Frequency :
117MHz
Number of Pins :
165
Terminal Finish :
Tin/Lead (Sn/Pb)
Memory Format :
SRAM
Height Seated (Max) :
1.2mm
Mounting Type :
Surface Mount
Access Time :
7.5ns
Standby Voltage-Min :
3.14V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Terminal Position :
BOTTOM
Supply Voltage-Min (Vsup) :
3.135V
Supply Current-Max :
0.475mA
I/O Type :
COMMON
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Memory Size :
18Mb 512K x 36
Number of Terminations :
165
Organization :
512KX36
Length :
15mm
Pin Count :
165
Packaging :
Tray
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
3.135V~3.465V
Surface Mount :
yes
Package / Case :
165-TBGA
HTS Code :
8542.32.00.41
Supply Voltage-Max (Vsup) :
3.465V
Memory Interface :
Parallel
JESD-609 Code :
e0
Output Characteristics :
3-STATE
Operating Temperature :
-40°C~85°C TA
Number of Functions :
1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Standby Current-Max :
0.075A
Power Supplies :
2.5/3.33.3V
Supply Voltage :
3.3V
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLF51236-7.5B3I from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:165, Mounting Type:Surface Mount, Number of Terminations:165, Package / Case:165-TBGA, Operating Temperature:-40°C~85°C TA, IS61NLF51236-7.5B3I pinout, IS61NLF51236-7.5B3I datasheet PDF, IS61NLF51236-7.5B3I amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLF51236-7.5B3I ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61NLF51236-7.5B3I


Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLF51236-7.5B3I Overview

The IS61NLF51236-7.5B3I, a high-performance SRAM from Integrated Silicon Solution, Inc. (ISSI), offers a substantial 18Mbit storage capacity in a densely packed 165TFBGA package. Designed for demanding applications requiring rapid access to large volumes of data, this IC features a parallel interface ensuring fast data transfer speeds while maintaining low power consumption. Ideal for B2B customers looking to implement advanced memory solutions in commercial and industrial applications, the Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLF51236-7.5B3I is engineered for reliability and high-speed operation.

IS61NLF51236-7.5B3I Features

This 18Mbit SRAM chip operates at 7.5ns access time, providing quick read and write capabilities essential for high-performance computing environments. The 165TFBGA package not only minimizes the footprint on circuit boards but also enhances thermal management and reduces electromagnetic interference, crucial for stable operations.

IS61NLF51236-7.5B3I Applications

  • Networking Equipment: Utilized in routers and switches to manage data flow efficiently and enhance buffer memory.
  • High-Performance Computing: Provides the necessary speed and capacity for temporary data storage in supercomputers and server farms.
  • Telecommunications: Acts as a reliable storage solution in telecommunications infrastructure, supporting high-speed data transmission and processing.
  • Aerospace and Defense: Meets the rigorous memory requirements for navigation and control systems in aerospace and defense applications.
  • Industrial Automation: Integral in complex industrial machines for process control, where quick access to data is crucial for operational efficiency.
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