IS61NLF102418-6.5B3

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Mfr.Part #
IS61NLF102418-6.5B3
Manufacturer
Integrated Silicon Solution, Inc. (ISSI)
Package / Case
165-TBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165TFBGA
Stock
24,096
In Stock :
24,096

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Manufacturer :
Integrated Silicon Solution, Inc. (ISSI)
Product Category :
Memory
Memory Format :
SRAM
Number of Pins :
165
Qualification Status :
Not Qualified
Pbfree Code :
No
Standby Current-Max :
0.06A
Terminal Pitch :
1mm
Clock Frequency :
133MHz
Organization :
1MX18
Standby Voltage-Min :
3.14V
Memory Interface :
Parallel
Surface Mount :
yes
Supply Voltage :
3.3V
Package / Case :
165-TBGA
Mounting Type :
Surface Mount
Length :
15mm
Supply Current-Max :
0.45mA
Memory Density :
18874368 bit
Additional Feature :
FLOW-THROUGH ARCHITECTURE
Packaging :
Tray
Memory Size :
18Mb 1M x 18
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Supply Voltage-Max (Vsup) :
3.465V
Terminal Finish :
Tin/Lead (Sn/Pb)
Operating Temperature :
0°C~70°C TA
Terminal Position :
BOTTOM
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Supply Voltage-Min (Vsup) :
3.135V
HTS Code :
8542.32.00.41
Access Time :
6.5ns
Height Seated (Max) :
1.2mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Pin Count :
165
Width :
13mm
Voltage - Supply :
3.135V~3.465V
Memory Width :
18
JESD-609 Code :
e0
Output Characteristics :
3-STATE
Number of Functions :
1
RoHS Status :
ROHS3 Compliant
Power Supplies :
2.5/3.33.3V
Memory Type :
Volatile
Number of Terminations :
165
I/O Type :
COMMON
ECCN Code :
3A991.B.2.A
Introducing Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLF102418-6.5B3 from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:165, Package / Case:165-TBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Number of Terminations:165, IS61NLF102418-6.5B3 pinout, IS61NLF102418-6.5B3 datasheet PDF, IS61NLF102418-6.5B3 amp .Beyond Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLF102418-6.5B3 ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Integrated Silicon Solution, Inc. (ISSI) IS61NLF102418-6.5B3


Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLF102418-6.5B3 Overview

The Memory Integrated Silicon Solution, Inc. (ISSI) IS61NLF102418-6.5B3 is a high-performance SRAM component designed to meet the rigorous demands of high-speed computing and advanced networking systems. With a generous 18Mbit capacity and a fast access time of 6.5 ns, this IC ensures exceptional throughput and reliability for critical applications. Encased in a compact 165TFBGA package, it offers optimal space-saving on PCBs while maintaining robustness and ease of integration into various electronic systems. This overview highlights the IC's superiority in delivering fast, efficient, and reliable memory solutions, making it a top choice for businesses seeking bulk procurement of cutting-edge technology.

IS61NLF102418-6.5B3 Features

This IC SRAM features 18Mbit of parallel data storage, packaged efficiently in a 165TFBGA format. The core functionality of the IS61NLF102418-6.5B3 includes its ultra-fast access time of 6.5 ns, which facilitates high-speed data operations essential for modern electronics. The device operates over a standard temperature range, ensuring reliability and performance consistency across varied environmental conditions.

IS61NLF102418-6.5B3 Applications

  • Advanced Networking Equipment: Utilized in routers and switches, where fast memory access is critical for high-speed data transfer and signal integrity.
  • High-performance Computing Systems: Serves as cache memory in servers and high-end workstations to speed up data fetch and execution times.
  • Aerospace and Defense: Employed in applications requiring robust memory solutions that can withstand extreme conditions while providing reliable and quick data access.
  • Telecommunication Infrastructure: Helps in managing data-intensive operations and storage needs in telecommunications hardware.
  • Automotive Electronics: Integrated into automotive systems for advanced navigation, infotainment, and autonomous driving technologies.
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